Die Bonding Workbench
A workbench and chip technology, which is applied in the manufacture of conveyor objects, electrical components, semiconductor/solid-state devices, etc., can solve the problems of substrate displacement and deviation, and achieve the effect of no material deformation, no material displacement, and accurate positioning
Active Publication Date: 2016-06-08
SHENZHEN DONG HONG XIN STATIC EQUIP
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Problems solved by technology
At present, when bonding or gluing the substrate and cover of the chip, the bonding positioning platform used is a relatively simple positioning groove structure. Although there is a production line controlled by a manipulator, the manipulator only operates according to a predetermined program. When the positioning platform of the chip has moved slightly, the manipulator will still place the chip at the pre-positioned position input by the program, and will not make corresponding adjustments according to the displacement of the positioning platform
Moreover, since the size of the positioning groove is slightly larger than the size of the chip, during the bonding operation, the substrate will inevitably be displaced due to the influence of the bonding force. This small displacement is relative to the size between the positioning groove and the chip. The gap is very small, but this may cause large deviations for chips with micron-scale units of measurement
Method used
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[0018] Below in conjunction with accompanying drawing, the present invention is described in further detail:
[0019] Die-bonding stations, such as figure 1 and figure 2 As shown, it includes a base 1 which is a cuboid cavity structure as a whole, and a square positioning groove corresponding to the shape and size of the chip is provided on the top of the base 1 . The surface roughness of the bottom plate 2 of the positioning groove is Ra3.2. The size of each side of the bottom plate 2 of the positioning groove is 0.10-0.20 mm larger than the size of the corresponding side of the chip. A number of small vacuum adsorption holes 3 are provided on the bottom plate 2, and the cavity at the bottom of the base is a vacuum cavity with a sealed structure. The vacuum chamber communicates with several small vacuum adsorption holes 3, and a vacuum device with a control switch is arranged on one side of the vacuum chamber. The vacuuming device is a vacuum pump, and the power conditio...
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The invention discloses a chip bonding workbench, comprising a base, the top of the base is provided with a positioning groove corresponding to the shape and size of the chip, the bottom plate of the positioning groove is provided with a number of small vacuum adsorption holes, and the several vacuum adsorption small holes pass through A commonly communicated vacuum chamber is connected to the vacuuming device. At least one side wall of the positioning slot is configured as a slope that shrinks toward the bottom plate. The size of each side of the bottom plate of the positioning groove is 0.10-0.20 mm larger than the size of the corresponding side of the chip, and the angle between the side wall of the positioning groove and the bottom plate is 50°-70°. The lower part of the base is provided with a vacuum chamber communicated with several small vacuum adsorption holes, and a vacuum pump with a control switch is provided on one side of the vacuum chamber. The invention has the advantages of precise positioning, no deformation of materials during the bonding process, no displacement of materials during the bonding process, and self-adjustment function.
Description
technical field [0001] The invention relates to an auxiliary positioning tool in chip processing, in particular to a positioning workbench used for chip bonding. Background technique [0002] With the rapid development of chip technology, people have higher and higher requirements for the tools and equipment used in chip processing. The preparation of the chip is calculated in microns, and the production accuracy is high. Therefore, accurate positioning of the chip is an important task indicator in the production process. At present, when bonding or gluing the substrate and cover of the chip, the bonding positioning platform used is a relatively simple positioning groove structure. Although there is a production line controlled by a manipulator, the manipulator only operates according to a predetermined program. When the positioning platform of the chip has moved slightly, the manipulator will still place the chip at the pre-positioning position input by the program, and wi...
Claims
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IPC IPC(8): H01L21/68H01L21/677
Inventor 白向阳
Owner SHENZHEN DONG HONG XIN STATIC EQUIP