Loop parallel type heat pipe radiator

Abstract

The invention belongs to the technical field of power electronic power device heat dissipation, and particularly relates to a loop parallel type heat pipe radiator. The loop parallel type heat pipe radiator comprises a radiator body and a power device installation base plate and is characterized in that a set of tubular annular cavities are formed in the radiator body, a set of end covers which are arranged at the upper portions of the tubular annular cavities respectively are arranged in the radiator body, and each tubular annular cavity comprises an evaporator, a condenser, a steam passageway, a condensing medium backflow passageway, a liquid accumulator and a capillary liquid suction core arranged in each evaporator. A loop parallel type heat pipe is directly formed in each tubular annular cavity, the characteristic that heat can be efficiently transmitted through a two-phase fluid return circuit which is exclusively arranged in the loop parallel type heat pipes is fully used, therefore, the heat transmission performance of the radiator is effectively improved, the contact thermal resistance between the heat pipes and a profile and the contact thermal resistance between cooling fins and the base plate are completely avoided, the heat dissipation efficiency is obviously improved, the generality is very strong, and the radiator is flexible in application, simple in process and low in cost.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of power electronic power devices, and in particular relates to a loop parallel heat pipe radiator. Background technique [0002] It has become a trend to use heat pipe radiators to dissipate heat from power electronic power devices. At present, the vast majority of heat pipe radiators are assembled by heat pipes and solid profile radiators through interference expansion, brazing or threaded connections (such as CN201010512127.3), and directly drilled on the radiator body. Hole forming (such as CN203103278U). These methods inevitably produce contact thermal resistance between the heat pipe and the solid profile, which directly affects the heat transfer efficiency, and the hollow aluminum heat pipe radiators seen all adopt a single siphon heat pipe structure, and when a single siphon heat pipe works In the gas-liquid mixed flow state, the reflux of the condensed liquid becomes very slow ...

AI Technical Summary

Problems solved by technology

These methods inevitably produce contact thermal resistance between the heat pipe and the solid profile, which directly affects the heat transfer efficiency, and the hollow aluminum heat pipe radiators seen all adopt a single siphon heat pipe structure, and when a single siphon heat pipe works In the gas-liquid mixed flow state, the reflux of the condensed liquid becomes very slow due to the resistance of the evaporating gas. Therefore, in order to increase the reflux speed of the condensed liquid, it is necessary to install a capillary liquid wick in the heat pipe cavity. The suction of the wick and the natural gravity guide promote the return of condensed liquid

Due to the addition of a capillary wick in the heat pipe cavity, the steam channel of a single siphon heat pipe becomes narrow, which hinders the heat transfer capacity of the heat pipe, especially the single siphon heat pipe at 0 0 It is difficult to use near the corner, and its heat transfer ability will be rapidly attenuated

The heat pipe radiators seen at present are all designed and manufactured for a certain type of power device, and their application limitations are relatively large, which will inevitably lead to a wide variety of radiator bodies, cumbersome processes, and increased costs.

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