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Mechanical packaging LED device and mechanical packaging method

A kind of LED device and mechanical technology, which is applied in the field of LED devices and packaging, can solve the problems of easy aging and deterioration, burning or chemical reaction, poor UV resistance, etc.

Active Publication Date: 2013-12-25
HONGLI ZHIHUI GRP CO LTD
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  • Application Information

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Problems solved by technology

[0002] At present, the packaging of LED devices mostly adopts organic materials such as silica gel and epoxy resin to seal and protect the chips, and realizes packaging after curing. It is easy to age and deteriorate in the ultraviolet environment. In addition, under some high and low temperature, high power or pollution conditions, the packaging material will crack, burn or chemically react, resulting in device failure

Method used

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  • Mechanical packaging LED device and mechanical packaging method
  • Mechanical packaging LED device and mechanical packaging method
  • Mechanical packaging LED device and mechanical packaging method

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Embodiment Construction

[0021] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0022] Such as figure 1 and figure 2 As shown, the mechanically packaged LED device includes a substrate 1 , an LED chip 2 , a sealing ring 3 , a transparent window 4 , a pressing plate 5 and a fastener 6 .

[0023] Such as image 3 and Figure 4 As shown, the substrate 1 is provided with a cavity 11, and the bottom surface of the cavity 11 is a crystal bonding area, and a concave step 12 is provided on the upper edge of the cavity on the substrate; the substrate material can be metal, ceramics and other materials.

[0024] The above-mentioned LED chip can be a single chip or an integrated chip array. The LED chip 2 is fixed on the die-bonding area through a die-bonding or eutectic process, and the circuit connection is completed.

[0025] The sealing ring 3 is made of silicone rubber, fluororubber or fluorosilicone rubber, which...

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Abstract

The invention discloses a mechanical packaging LED device and a mechanical packaging method. The LED device comprises a substrate. A cavity is formed in the substrate and an LED chip is arranged in the cavity. A downwards-recessed step is arranged at the upper edge, located on the cavity, of the substrate, a transparent window piece is arranged on the step, a pressing board used for pressing the transparent window piece is arranged on the substrate, and a fastening piece is arranged between the substrate and the pressing board. The packaging method comprises the steps of crystal solidification, transparent window piece placement and pressing board fixation. According to the LED device and the packaging method, the problems that in the ultraviolet environment, resin and organosilicon materials are prone to aging and deterioration or under the conditions of high-low temperature and high power or pollution, the packaging materials are fractured or burnt or reacted are solved, the device is prevented from losing efficiency, and the service life of the LED device is prolonged.

Description

technical field [0001] The invention relates to an LED device and a packaging method. Background technique [0002] At present, the packaging of LED devices mostly adopts organic materials such as silica gel and epoxy resin to seal and protect the chips, and realizes packaging after curing. It is very easy to age and deteriorate in the ultraviolet environment. In addition, under some high and low temperature, high power or pollution conditions, the packaging material will crack, burn or chemically react, resulting in device failure. Therefore, it is necessary to find a suitable packaging process for UV LED devices that are not suitable for organic materials and devices that are used in harsh environments such as special high temperature, high UV, and high pollution. Contents of the invention [0003] The first object of the present invention is to provide a mechanically packaged LED device, which has a simple structure, is not prone to failure under high temperature, stro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L25/075
Inventor 汤乐明黄敏尹键沙磊吴乾王跃飞
Owner HONGLI ZHIHUI GRP CO LTD
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