A method for improving the surface finish of solder balls

Abstract

The invention discloses a method and a device for improving the surface smoothness of solder balls, and belongs to the field of solder for packaging chips in the micro-electronic industry. The method and the device are used for solving problems of poor surface quality, high cost and decrease of solderability of the traditional process for manufacturing solder balls, and constraints on the diameters and the quantities of solder balls due to poor productivity of an autogenous grinding polishing method can be broken through. The method includes steps of 1), adding the solder balls to be treated into PU (polyurethane) material bottles, adding appropriate amounts of ceramic grinding stone and copper grinding agents into the PU material bottles, adding heavy-duty cleaners into the PU material bottles, filling water into the PU material bottles and reserving the PU material bottles for standby application; 2), placing the PU material bottles prepared in the step 1) onto a rotary vibration platform provided with a centrifugal motor; 3), setting the running time and clockwise and anticlockwise rotation moments of the motor and starting the motor; 4), separating the ground solder balls from the PU material bottles and packaging the solder balls again. Compared with the traditional process, the method and the device have the advantages that the surface smoothness of the solder balls can be obviously improved, the usage of the grinding agents can be flexibly adjusted according to the quantities of the solder balls, and the manufacturing cost is low.

Description

Technical field [0001] The invention belongs to the field of solder for chip packaging in the microelectronics industry, and specifically relates to a method for improving the surface finish of a tin ball. Background technique [0002] With the development of electronic products in the direction of slight thinness and diversification of functions, the packaging technology of integrated circuits is forced to follow up with high density, miniaturization and high integration. Integrated circuit ICs have moved from quadrilateral lead frame (QFP) to ball grid array Structure (BGA) packaging model changes. The BGA packaging method has: ①The package area is reduced; ②The function is increased, and the number of pins is increased; ③The PCB board can be self-centered and easy to tin when soldering; ④High reliability; ⑤Good electrical performance, low overall cost, etc. As people’s awareness of environmental protection has increased, the production of lead-free solder balls has been gradu...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a method for improving the surface finish of solder balls. This method can effectively solve the problems of poor surface quality, high cost and reduced solderability that cannot be solved by the traditional solder ball manufacturing process. At the same time, it breaks through the limitation of the diameter and quantity of solder balls due to the low production capacity of the self-grinding and polishing method.

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