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Packaging Structure of Optical Devices

A technology of packaging structure and optical device, which is applied in the directions of optical device exploration, measurement device, electromagnetic wave re-radiation, etc., can solve the problems such as the overall volume reduction of the proximity optical sensor 100, reduce the chance of transmission to the photosensitive element, reduce the production Cost and manufacturing difficulty, the effect of reducing the overall volume and size

Active Publication Date: 2016-11-02
PIXART IMAGING INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, although the design and use of the light-shielding structure 136 can effectively limit the travel path of light, it still causes the overall volume of the proximity photosensor 100 to be effectively reduced.

Method used

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  • Packaging Structure of Optical Devices
  • Packaging Structure of Optical Devices
  • Packaging Structure of Optical Devices

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Embodiment Construction

[0053] The aforementioned and other technical content, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only directions referring to the attached drawings. Accordingly, the directional terms are used to illustrate and not to limit the invention.

[0054] figure 2 It is a schematic diagram of a packaging structure of an optical device according to an embodiment of the present invention. The packaging structure 200 of the optical device in this embodiment can be illustrated by the structure of a proximity photosensor. Specifically, the packaging structure 200 of the optical device includes a substrate 210, a light emitting element 220, a photosensitive element 230, and a light blocking structure 240. . The light emitting element 220 is dispo...

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Abstract

The invention relates to a packaging structure of an optical device, which includes a substrate, a light-emitting element, a photosensitive element and a light-shielding structure. The light emitting element is arranged on the substrate and electrically connected with the substrate. The light emitting element is adapted to provide a light beam. The photosensitive element is arranged on the substrate, and the photosensitive element is a chip size package element, wherein the photosensitive element is suitable for receiving the light beam reflected by an object. The light blocking structure is arranged around the photosensitive element.

Description

technical field [0001] The present invention relates to a packaging structure, and in particular to a packaging structure of an optical device. Background technique [0002] figure 1 It is a schematic cross-sectional view of an existing package structure of a proximity photosensor. Please refer to figure 1 , the existing proximity photosensor 100 includes a light source 110 , a photodetector 120 and a packaging case 130 . The packaging case 130 has a first accommodating space 132 and a second accommodating space 134 respectively, wherein the light emitting source 110 is disposed in the first accommodating space 132 , and the light detector 120 is disposed in the second accommodating space 134 . In the proximity light sensor 100, when an object 101 approaches the proximity light sensor 100, the light beam L1 provided by the light source 110 will be reflected by the object 101 and transmitted back to the light detector 120, so that the object can be detected. 101 is close ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01V8/10H01L25/16
CPCH01L25/167G01V8/10H01L2224/16225H01L2224/73253H01L31/167G01S7/4813G01S17/04G01S7/4814G01S7/4816
Inventor 许恩峰陈念泽
Owner PIXART IMAGING INC
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