Packaging Structure of Optical Devices

Abstract

The invention relates to a packaging structure of an optical device, which includes a substrate, a light-emitting element, a photosensitive element and a light-shielding structure. The light emitting element is arranged on the substrate and electrically connected with the substrate. The light emitting element is adapted to provide a light beam. The photosensitive element is arranged on the substrate, and the photosensitive element is a chip size package element, wherein the photosensitive element is suitable for receiving the light beam reflected by an object. The light blocking structure is arranged around the photosensitive element.

Description

technical field

[0001] The present invention relates to a packaging structure, and in particular to a packaging structure of an optical device. Background technique

[0002] figure 1 It is a schematic cross-sectional view of an existing package structure of a proximity photosensor. Please refer to figure 1 , the existing proximity photosensor 100 includes a light source 110 , a photodetector 120 and a packaging case 130 . The packaging case 130 has a first accommodating space 132 and a second accommodating space 134 respectively, wherein the light emitting source 110 is disposed in the first accommodating space 132 , and the light detector 120 is disposed in the second accommodating space 134 . In the proximity light sensor 100, when an object 101 approaches the proximity light sensor 100, the light beam L1 provided by the light source 110 will be reflected by the object 101 and transmitted back to the light detector 120, so that the object can be detected. 101 is close ...

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