X-ray image multi-scale detail enhancement method in integrated circuit packaging

Abstract

The invention discloses an X-ray image multi-scale detail enhancement method in integrated circuit packaging, which comprises the steps of 1) acquiring X-ray images oriented to an integrated circuit packaging process; 2) performing Laplacian pyramid decomposition to the X-ray images to obtain X-ray pyramid detail images at all scales; 3) adjusting the brightness and the contrast of the images at the bottom layer of a pyramid by adopting a logarithm enhancement method; 4) adjusting the brightness and the contrast of the detail images at the top layer of the pyramid by adopting a histogram equalization enhancement method; 5) reconstructing the detail images at all scales to obtain detail enhanced images. The method disclosed by the invention has the advantages that the method is simple and fast, the dynamic range compression of images can be realized aiming at the X-ray images with low signal-to-noise ratio and poor defect contrast in the integrated circuit packaging, the useful information of the images is expanded, the image details are enabled to be more outstanding, the contrast of the images is improved and the accuracy is higher.

Description

technical field [0001] The invention relates to a method for enhancing details of an X-ray image, in particular to a method for enhancing multi-scale details of an X-ray image in an integrated circuit package. It belongs to the field of image processing. Background technique [0002] With the development of IC (Integrated Circuit Design) packaging technology, higher requirements are placed on the internal inspection of components. During the packaging process, the pads are exposed to the air for a long time, which is easy to oxidize and may have defects: cracks in the connection solder joints, no connection, excessive voids in the solder joints, wire and wire bonding, and problems with the die and connection interface , The colloid connected by conductive adhesive will also generate air bubbles during the packaging process, which will affect the packaging quality of extremely large-scale ICs. Invisible surface defects such as bump connections, joint joints, micro cracks, a...

AI Technical Summary

Problems solved by technology

During the packaging process, the pads are exposed to the air for a long time, which is easy to oxidize and may have defects: cracks in the connection solder joints, no connection, excessive voids in the solder joints, wire and wire bonding, and problems with the die and connection interface , the colloid connected by conductive adhesive will also produce air bubbles during the packaging process, which will affect the packaging quality of extremely large-scale ICs

[0004] The existing digital image enhancement technology is divided into two types: space domain and frequency domain: the enhancement method based on the space domain is based on the direct processing of image pixels, and the processing technology based on the frequency domain is based on the Fourier transform of the modified image. The biggest problem with these two methods is that there is no way to distinguish useful information from useless information

In addition, the method of multi-scale image enhancement is fast wavelet transform, but wavelet transform will bring artificial artifacts when enhancing complex structures

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