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A novel electronic grade polyimide film with low linear expansion coefficient and its manufacturing method

A technology of polyimide film and low linear expansion coefficient, which is applied in the field of polymer engineering materials, can solve unsolved problems, achieve high industrial application value, improve mechanical properties, and excellent adhesive properties

Active Publication Date: 2016-07-06
宏威高新材料有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Domestic and foreign patents or public documents have also carried out a single study on the above method, because it failed to comprehensively consider the special comprehensive performance requirements of modern information technology for flexible printed circuit boards for high-end polyimide film substrates, especially failed to solve Very low coefficient of linear expansion and excellent film-forming properties of polyamic acid, as well as the requirements of flexibility, adhesion, moisture expansion resistance and high mechanical properties of polyimide film materials

Method used

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  • A novel electronic grade polyimide film with low linear expansion coefficient and its manufacturing method
  • A novel electronic grade polyimide film with low linear expansion coefficient and its manufacturing method
  • A novel electronic grade polyimide film with low linear expansion coefficient and its manufacturing method

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preparation example Construction

[0042] A method for preparing a polyimide film with a low coefficient of linear expansion, comprising the following contents and process steps:

[0043] (1) Synthesis of step-by-step condensation polyamic acid resin: the present invention uses more than two kinds of diamine monomers and tetracarboxylic dianhydride as raw materials, and adopts the "interpenetrating compound in polymer kettle" technology of multi-stage step-by-step polymerization Synthesis of multi-component block copolymerized polyamic acid resin. That is, the polyamic acid A with the design viscosity is first synthesized by the general polyamic acid synthesis technology, and then another or more diamines and dianhydride monomers are added according to the design molar ratio, and the reaction is carried out for a period of time to obtain the original polyamide A-B-C-… type large block copolymerized polyamic acid in which polyamic acid B is inserted into the molecular chain of acid A. The outstanding advantage ...

Embodiment 1

[0065] Put 500 liters of DMF into the dissolution tank, add 1.00 molar ratio of ODA, start the mixer to stir and dissolve, and the dissolution time is 1 hour. After the diamine monomer is completely dissolved in the polar solvent, stop stirring, and use compressed air to dissolve the diamine monomer. The body solution is pressed into the stainless steel polymerization reaction kettle through the filter, the mixer is started, the cooling water is passed, and then the dianhydride monomer (PMDA, BPDA, BTDA and its composition) is gradually added in 8 times with a total molar ratio of 1.010 to 1.015. . From the 1st to 4th times, the amount of dianhydride added is controlled in equal amounts and at even intervals. A total of 50wt% of the total amount of dianhydride is added in the first 4 times. From the 5th to 8th times, each addition is 50wt% of the total amount of the remaining amount. Putting in, checking the viscosity of the resin after stirring and reacting for 5-10 minutes e...

Embodiment 2

[0068] Example 2 Synthesize the polyamic acid by the block copolymerization of multiple rigid chain acid anhydrides and two or more diamines of ether bonds or siloxane bonds by gradually adding diamine and dianhydride raw materials

[0069] First, the polar aprotic solvent (DMF, DMAc or NMP or any combination of any proportion) that is purified and pre-measured in the solvent tank and whose mass is 3.5 to 7 times the total amount of dianhydride and diamine monomers is put into the dissolution tank 0.50-0.70 molar ratio of ODA and 0.25-0.20 molar ratio of 1,3-bis(3-aminopropyl)tetramethyldisiloxane (APDS) were put into it through the automatic metering system, and the mixer was started to stir and dissolve , the dissolution time is not less than 1.5 hours. After the diamine monomer is completely dissolved in the polar solvent, stop stirring, and add 0.65-0.75 molar ratio of PMDA to the polymerization kettle in 5 batches at intervals of 10-30 minutes. After completion, continue ...

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Abstract

The invention relates to a method for producing a polyimide film with a low coefficient of linear expansion. Two or more polyamic acid glues; (2) superfine inorganic whiskers (such as zinc oxide whiskers, silicon carbide whiskers, zirconium tungstate whiskers) and / or nanoparticles whose surfaces are organically modified Material, with the help of high energy density ultrasonic crushing and cavitation, the above-mentioned functional fillers and the polyamic acid described in the present invention form in-situ micro-nano composites; (3) The above-mentioned composite glue is filtered, vacuum defoamed, and extruded. Casting film formation, chemical imidization or thermal imidization, infrared complete imidization, high temperature heat setting treatment, corona treatment, coiling process, the production thickness is (7.5~125)μm, the linear expansion coefficient is 5 ~18ppm / ℃, electronic grade polyimide film with excellent physical and mechanical properties.

Description

technical field [0001] The invention relates to a polyimide film with a low linear expansion coefficient that mainly meets the requirements of high-end flexible printed circuit boards and a production method thereof, in particular to a polyimide with a low linear expansion coefficient, which belongs to the technical field of polymer engineering materials. Background technique [0002] Polyimide (PI) refers to a class of aromatic heterocyclic polymers containing imide rings in the main chain. It has excellent mechanical, dielectric, radiation resistance, and corrosion resistance at high temperatures. It is an organic polymer One of the materials with the best comprehensive properties among materials, known as the "Pearl in the Crown" of high-tech materials and the "expert" in solving microelectronics technologies such as VLSI in the 21st century, it is used in aerospace, electronic information, automobiles Industry and other fields have a broad application space. [0003] Po...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10C08K9/06C08K9/04C08K7/10C08K7/08C08K7/06C08K3/36C08K3/22C08K3/24
Inventor 李晓敏袁萍黄渝鸿李旺曹君袁彬彬杨帆陈凤阳龑黄小诚李涛韩青霞
Owner 宏威高新材料有限公司
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