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Electronic device

A technology for electronic devices and electronic components, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of rising shell temperature, small internal space of electronic products, affecting consumer use, etc., and achieves good thermal insulation effect, small thermal conductivity, good thermal insulation effect

Inactive Publication Date: 2014-01-29
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0003] However, due to the relatively small internal space of electronic products, the heat sink is usually close to the shell of the electronic product. The heat generated by the heating electronic components is absorbed by the heat sink and then transferred to the shell, resulting in the high temperature of the shell and the formation of hot spots, which makes the user feel unwell
At present, the commonly used method in the industry is to paste heat-soaking materials (such as copper / aluminum foil, etc.) inside the casing to spread the hot spots on the casing and reduce the temperature of the hot spots, but the overall temperature of the casing will still rise, which will affect the use of consumers.

Method used

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Embodiment Construction

[0013] like figure 1 and figure 2 As shown, an electronic device 100 according to an embodiment of the present invention includes a heat-generating electronic component 10 , a heat-dissipating device 20 , a casing 30 and a heat-insulating layer 40 .

[0014] The heat dissipation device 20 is used for dissipating heat from the heat-generating electronic component 10 . The heat dissipation device 20 includes a centrifugal fan 22 , a heat pipe 21 around the centrifugal fan 22 , a cooling fin set 23 in thermal contact with one end of the heat pipe 21 , and a heat absorbing plate 24 attached to the heat-generating electronic component 10 .

[0015] The heat pipe 21 is L-shaped and flat, and includes an evaporating section 211 , a condensing section 212 and a connecting section 213 connecting the evaporating section 211 and the condensing section 212 .

[0016] The centrifugal fan 22 includes a frame body 221 and an impeller set 222 disposed in the frame body 221 . The frame bod...

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Abstract

An electronic device comprises a heating electronic element, a cooling device, a shell and a heat insulating layer, wherein the cooling device is arranged on the heating electronic element and used for cooling the heating electronic element, the cooling device and the heating electronic element are positioned on the same side of the shell, and the heat insulating layer is positioned on the cooling device, adjacent to one side of the shell and made of aerogel materials.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device with a casing. Background technique [0002] At present, in electronic products, the heat generated by the electronic components during the working process continues to increase, so it is necessary to install a heat dissipation device to dissipate the heat. [0003] However, due to the relatively small internal space of electronic products, the heat sink is usually close to the shell of the electronic product. The heat generated by the heating electronic components is absorbed by the heat sink and then transferred to the shell, resulting in the high temperature of the shell and the formation of hot spots, which makes users feel discomfort. At present, the commonly used method in the industry is to paste heat-soaking materials (such as copper / aluminum foil, etc.) inside the casing to spread the hot spots on the casing and reduce the temperature of the hot spots. Howeve...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 林恒生陈荣安
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD
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