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Multi-stage heat sink, cooling system with the same and method for controlling the same

A technology of cooling system and radiator, applied in the direction of temperature control, non-electric variable control, control/regulation system, etc., can solve the problems of reducing heat transfer and heat dissipation efficiency of radiator, increasing temperature difference, etc.

Inactive Publication Date: 2014-01-29
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] That is, because the temperature difference between the ends of the horizontal heat sink and the ends of the vertical fins constituting the prior art heat sink increases, the amount of heat transfer may be relatively reduced and the heat sink has a very limited heat dissipation efficiency.

Method used

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  • Multi-stage heat sink, cooling system with the same and method for controlling the same
  • Multi-stage heat sink, cooling system with the same and method for controlling the same
  • Multi-stage heat sink, cooling system with the same and method for controlling the same

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Embodiment Construction

[0040] Through the following detailed description in conjunction with the accompanying drawings, the purpose, features and advantages of the present invention can be more clearly understood. In the drawings, the same reference numerals are used to designate the same or similar components, and redundant descriptions of the components are omitted. In addition, in the following description, the terms "first", "second", "one side", "another side" and the like are used to distinguish a specific element from other elements, but the configuration of these components should not be construed to be limited by these terms. Also, in the specification of the present invention, when it is determined that detailed descriptions of related arts would obscure the gist of the present invention, the descriptions will be omitted.

[0041] Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

[0042] figure...

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Abstract

Disclosed herein is a multi-stage heat sink cooling system, including: at least one step surface in a direction of a surface to which cooling air is injected, wherein the step surface is any one of a step surface having a stair shape that is provided with a plurality of heat radiating plates each having a curve, a step surface provided with a plurality of heat radiating plates having a streamlined smooth curve, and a step surface provided with a plurality of heat radiating fins having a height difference. According to the preferred embodiments of the present invention, the cooling system with the multi-stage heat sink can cool heat generated from a heat radiating element using the multi-stage heat sink and the air injection part to improve a heat release rate.

Description

[0001] Cross References to Related Applications [0002] This application requires the title of "Multi-Stage Heat Sink, Cooling System With the Same and Method for Controlling the Same" submitted on July 10, 2012 (multi-stage radiator, cooling system with the multi-stage radiator and control) The priority of Korean Patent Application No. 10-2012-0075121, the entire content of which is incorporated by reference in this application. technical field [0003] The invention relates to a multi-stage radiator, a cooling system with the multi-stage radiator and a method for controlling the cooling system. Background technique [0004] Optical communication components and electrical and electronic components are miniaturized by using semiconductor devices, and heat generation due to miniaturization causes noise, shortened life, and unstable output characteristics, so it is absolutely necessary for these components to be cooled and kept at a constant temperature Down. For example, s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/467G05D23/20
CPCF28F13/12H01L23/467F28F27/00H01L2924/0002H01L2924/00H05K7/20H01L23/34G06F1/20
Inventor 洪昌燮郭煐熏孙莹豪
Owner SAMSUNG ELECTRO MECHANICS CO LTD