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Positioning device and method for welding point of piezoelectric ceramic chip in piezoelectric sensor

A technology of piezoelectric ceramic sheets and piezoelectric sensors, which is applied to the measurement of fluid pressure using piezoelectric devices and the measurement of the properties and forces of piezoelectric devices, and can solve the problems of no positioning basis for welding points of piezoelectric ceramic sheets. , to achieve the effect of broadening the detection range and improving the sensitivity

Inactive Publication Date: 2015-06-17
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to solve the problem that the welding point of the piezoelectric ceramic sheet in the existing piezoelectric sensor has no basis for positioning, and now provides a positioning device and method for the welding point of the piezoelectric ceramic sheet in the piezoelectric sensor

Method used

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  • Positioning device and method for welding point of piezoelectric ceramic chip in piezoelectric sensor
  • Positioning device and method for welding point of piezoelectric ceramic chip in piezoelectric sensor
  • Positioning device and method for welding point of piezoelectric ceramic chip in piezoelectric sensor

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specific Embodiment approach 1

[0027] Specific implementation mode 1: refer to Figure 1 to Figure 4 Specifically describing this embodiment, the positioning device for the welding point of the piezoelectric ceramic sheet in the piezoelectric sensor described in this embodiment includes: an intelligent control module 1, a first data serial port 21, a second data serial port 22, and a first intelligent driver Module 31, first transmission mechanism 33, second intelligent drive module 32, second transmission mechanism 34, micro-vibration spring device 4 and pressure sensor group 15;

[0028] The intelligent control module 1 is connected with the first intelligent drive module 31 through the first data serial port 21, the first intelligent drive module 31 is used to drive the first transmission mechanism 33 to move, and the intelligent control module 1 is connected with the second intelligent drive through the second data serial port 22. The module 32 is connected, the second intelligent drive module 32 is use...

specific Embodiment approach 2

[0038] Embodiment 2: This embodiment further describes the positioning device for the welding point of the piezoelectric ceramic sheet in the piezoelectric sensor described in Embodiment 1. In this embodiment, the elastic coefficients of the four micro-vibration springs are all 150N / m to 160N / m.

specific Embodiment approach 3

[0039] Specific implementation mode three: refer to Figure 5 This embodiment is specifically described. This embodiment adopts the positioning device for the welding point of the piezoelectric ceramic sheet in the piezoelectric sensor described in the first embodiment to realize the positioning method of the welding point of the piezoelectric ceramic sheet in the piezoelectric sensor. The positioning method Include the following steps:

[0040] Step 1: Clamp the piezoelectric ceramic sheet between the top post and the micro-vibration spring, so that each top post corresponds to a micro-vibration spring up and down, manually adjust the knob to make the compression distances of the four micro-vibration springs equal, and then perform step 2;

[0041] Step 2: The intelligent control module 1 controls the first intelligent drive module 31 or the second intelligent drive module 32 at the same time, so that a micro-vibration spring and its corresponding top column move to the positio...

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Abstract

The invention belongs to the field of piezoelectric sensors, and provides a positioning device and method for a welding point of a piezoelectric ceramic chip in a piezoelectric sensor. The positioning device and method aim to solve the problem that there is no basis for positioning a welding point of a piezoelectric ceramic chip in an existing piezoelectric sensor. According to the positioning device and method for the welding point of the piezoelectric ceramic chip in the piezoelectric sensor, electrical signal data at all contact points between a microseismic spring and the piezoelectric ceramic chip are detected, the sensitivity calculation is carried out on the electrical signal data at all the contact points and sensitivity values of all the contact points are compared to obtain the point with the biggest sensitivity value, and namely the best welding point of the piezoelectric ceramic chip is obtained. According to the welding point, the piezoelectric ceramic chip is welded in the piezoelectric sensor, and the sensitivity of the piezoelectric sensor is improved by 75%, accordingly, the detection scope of the piezoelectric sensor is broadened, and the detection and conversion of small signals through the piezoelectric sensor can be achieved. The positioning device and method are suitable for positioning the welding point of the piezoelectric ceramic chip in the piezoelectric sensor.

Description

technical field [0001] The invention belongs to the field of piezoelectric sensors. Background technique [0002] Sensor is a kind of device with detection function widely used in industry, agriculture, national defense and medicine. Piezoelectric sensor is a device that uses the piezoelectric effect of piezoelectric ceramic sheets to convert stress or strain into voltage or charge, and then amplifies and outputs through an amplifier. The piezoelectric sensor is composed of three parts: the mechanical system that transmits the external force to the piezoelectric ceramic sheet, the piezoelectric ceramic sheet and the measurement circuit that transmits the electric charge to the instrument. Piezoelectric ceramic sheet is the key component of piezoelectric sensor. From the perspective of signal conversion, piezoelectric ceramic sheet is equivalent to a charge generator. The mechanical system is the part of the bracket that installs and fixes the piezoelectric ceramic sheet. T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/16G01L9/08
Inventor 迟庆国杨奉佑田朔任雄飞崔洋张昌海王鑫鑫马涛
Owner HARBIN UNIV OF SCI & TECH