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Three-dimensional flexible substrate packaging structure and manufacturing method for multi-shielded chips

A flexible substrate and packaging structure technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as processing without considering the leakage radiation of the chip 112, and achieve electromagnetic interference reduction, high packaging density, and structural Small size effect

Active Publication Date: 2016-06-01
NAT CENT FOR ADVANCED PACKAGING CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The shielding case 101 takes into account the mutual interference between the shielding chips 108 and 112, but does not consider the radiation leakage from the bottom of the chip 112

Method used

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  • Three-dimensional flexible substrate packaging structure and manufacturing method for multi-shielded chips
  • Three-dimensional flexible substrate packaging structure and manufacturing method for multi-shielded chips
  • Three-dimensional flexible substrate packaging structure and manufacturing method for multi-shielded chips

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Embodiment Construction

[0036] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0037] Such as Figure 2 to Figure 7 Shown: a three-dimensional flexible substrate packaging structure for multi-shielding chips, including a flexible substrate 1, the first metal shielding layer 2 and the second metal shielding layer 3 are preset in the flexible substrate 1; There is a conduction hole 4 penetrating through the front and back of the flexible substrate 1, and the conduction hole 4 is filled with a metal conductive material. Disk electrical connection; a blind hole 5 is also opened in the flexible substrate 1, and the blind hole 5 is filled with a metal conductive material, and the second metal shielding layer 3 is electrically connected to the grounding pad on the reverse side of the flexible substrate 1 through the blind hole 5 ; The via hole 4 is insulated from the second metal shielding layer 3 .

[0038] The first chip to be shielded 6 is ...

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Abstract

The invention provides a three-dimensional flexible substrate packaging structure used for multi-shield chips. The three-dimensional flexible substrate packaging structure used for the multi-shield chips comprises a flexible substrate, and a first metal shielding layer and a second metal shielding layer are prearranged in the flexible substrate; the chips needing to be shielded are attached to the front face and the back face of the flexible substrate respectively, the portions on the two sides of the flexible substrate are bent to the middle of the front face of the flexible substrate to form two U-shaped shielding parts; the respective upper portions, on the flexible substrate, of the two U-shaped shielding parts are partially overlapped in the height direction, and the upper portion, on the flexible substrate, of the second U-shaped shielding part is located above the upper portion, on the flexible substrate, of the first U-shaped shielding part. The first chips needing to be shielded are distributed in the first U-shaped shielding part, and the second chips needing to be shielded are distributed between the upper portion, on the flexible substrate, of the first U-shaped shielding part and the upper portion, on the flexible substrate, of the second U-shaped shielding part. The chips needing to be shielded are wrapped in the metal shielding layers. The three-dimensional flexible substrate packaging structure used for the multi-shield chips solves the problem of electromagnetic interference with the outside caused by the chips with strong electromagnetic radiation, and the packaging structure is more compact.

Description

technical field [0001] The invention relates to a packaging structure, in particular to an electromagnetic shielding packaging structure using a flexible substrate. Background technique [0002] With the development of microelectronics technology and the complexity and diversification of microelectronic processing functions, the integration density of electronic components in the substrate in microelectronics is increasing, which is bound to increase the micro-assembly density and the sudden increase in integration. Improving the overall integration of packaging and electromagnetic shielding for devices with strong electromagnetic radiation put forward higher requirements, the process difficulty increases, and the normal operation of the system must be guaranteed. [0003] figure 1 It is an existing electromagnetic shielding solution, which is mainly to install an electromagnetic shielding cover on the semiconductor packaging structure to shield the electromagnetic interfer...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L23/60H01L21/50H01L21/60H01L25/16
CPCH01L2224/16225H01L2224/32225H01L2224/73204H01L2224/73253H01L2924/00
Inventor 徐健王宏杰孙鹏陆原
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD
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