High thermal conductivity and EMI sheltering high polymer composite material

A polymer and composite material technology, applied in the field of polymer composite materials

Inactive Publication Date: 2014-02-12
TENNRICH INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the above-mentioned polymer composite materials do not have the performance of solving EMI el

Method used

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  • High thermal conductivity and EMI sheltering high polymer composite material

Examples

Experimental program
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Effect test

Embodiment 1

[0037] Add 12wt% graphene (Graphene Laboratories Inc.) and 36wt% ferrite magnet (Fe 3 o 4 , Aldrich-637106) in 52wt% epoxy resin, and add another 1wt% dispersant, fully mixed to make it evenly dispersed, so as to manufacture a polymer composite material with both thermal conductivity and EMI shielding.

Embodiment 2

[0039] Add 18wt% graphene (Graphene Laboratories Inc.) and 30wt% ferrite magnet (Fe3O4, Aldrich-637106) in 52wt% epoxy resin, and add 1wt% dispersant in addition, fully mix, make it disperse evenly, In this way, a polymer composite material with thermal conductivity and EMI shielding is manufactured.

Embodiment 3

[0041] Add 34wt% graphene (Graphene Laboratories Inc.) and 22wt% ferrite magnet (Fe3O4, Aldrich-637106) to 44wt% epoxy resin, and add 1.7wt% dispersant, mix well to make it evenly dispersed , so as to manufacture a polymer composite material with both thermal conductivity and EMI shielding.

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PUM

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Abstract

The invention provides a high polymer composite material, which is formed by fully blending a thermal conduction material (such as graphene), with an electromagnetic wave shielding material with EMI shielding efficacy and a high polymer binder. Thus, the thermal conductivity coefficient and the shielding efficiency of the overall composite material are enhanced, so that the provided composite material can be ensured to have thermal energy dissipated by a heat producing source and can effectively shelter electromagnetic wave interference.

Description

technical field [0001] The invention relates to a polymer composite material, in particular to a polymer composite material capable of absorbing electromagnetic waves, shielding electromagnetic wave interference, and high thermal conductivity. Background technique [0002] In recent years, electronic components such as CPUs, MPUs, and LSIs, which are installed inside personal computers and mobile phones, are all oriented towards high-density and high-integration designs. As a result, due to the increase in precision, electromagnetic waves are scattered inside electronic products, resulting in internal electromagnetic wave disturbances. Interference problem; with CPU, MPU, LSI and other electronic components operating under high-performance, high-transmission, and high-efficiency conditions, resulting in increased heat generation, if the waste heat generated during operation cannot be efficiently removed, the temperature between electronic components A large increase will cau...

Claims

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Application Information

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IPC IPC(8): C08L101/00C08L63/00C08K3/04C08K3/22C08K7/06C08K3/08
Inventor 陈世惠林进田郑华琦
Owner TENNRICH INT
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