Light-curing thermal-curing resin composition

A thermal curing resin, light curing technology, applied in the field of materials

Active Publication Date: 2014-02-12
SHANGHAI FUSAITE NEW MATERIAL
View PDF11 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The surface of the circuit board is provided with a cover film, such as patents CN101747854, CN101378622 and CN102209429 which disclose the cover film and flexible circuit board on the circuit board. The above-mentioned several patents are usually Polyimide film is coated with polyimide resin, epoxy resin, and acrylic resin. However, with the refinement of the circuit, the traditional cover film has processing accuracy problems when punching holes. When pressing the cover film to cover the circuit board, there is a problem of adhesive (glue) seeping out. In short, with the rapid development of the circuit board, the traditional cover film technology can no longer meet the market requirements.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light-curing thermal-curing resin composition
  • Light-curing thermal-curing resin composition
  • Light-curing thermal-curing resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0066] In a four-neck flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 25.00 grams (0.1 moles) of xylylmethane 4,4-diisocyanate, and 15 grams of γ-butyrolactone, and stir After homogenizing, heat to 90 degrees, and then add 11.34 grams (0.035 mole ), polycarbonate diol (product of Asahi Kasei Co., Ltd., PCDL T5651) 25 g (0.025 mol), dimethylolpropionic acid 1.34 g (0.01 mol) and γ-butyrolactone 35 g, this solution was heated , stirred, and after 10 hours, a uniform transparent viscous polymer liquid was obtained. Then add 26.18 grams of pyromellitic dianhydride (0.12 moles) and 25 grams of gamma-butyrolactone in the solution, adjust the reaction temperature to 180 degrees, after becoming a uniform orange-red solution, heat for 2 hours, and then Start to lower the temperature. After the temperature in the reactor drops to 70 degrees, add 20.92 grams (0.18 moles) of hydroxyethyl acrylate and 12 grams of γ-butyrolactone to the reaction s...

Synthetic example 2

[0068] In a four-neck flask equipped with a stirrer, a reflux condenser, and a nitrogen tube, feed nitrogen, add 25.00 grams (0.1 moles) of xylylmethane 4,4-diisocyanate, and 15 grams of γ-butyrolactone, and stir After homogenizing, heat to 90 degrees, and then add 11.34 grams (0.035 mole ), polycarbonate diol (product of Asahi Kasei Co., Ltd., PCDL T5651) 25 g (0.025 mol), dimethylolpropionic acid 1.34 g (0.01 mol) and γ-butyrolactone 35 g, this solution was heated , stirred, and after 10 hours, a uniform transparent viscous polymer liquid was obtained. Then add 26.18 grams of pyromellitic dianhydride (0.12 moles) and 25 grams of gamma-butyrolactone in the solution, adjust the reaction temperature to 180 degrees, after becoming a uniform orange-red solution, heat for 2 hours, and then Start to cool down, after the temperature in the reactor drops to 70 degrees, add 23.40 grams (0.18 moles) of hydroxyethyl methacrylate and 14 grams of γ-butyrolactone to the reaction system, a...

experiment example 1

[0077] Experimental Example 1, Appearance Inspection

[0078] Observe the surface of the developed sample with the naked eye. Compared with before development, it is necessary that the surface gloss does not change. If the surface gloss becomes lighter or the surface is discolored, it is considered that it cannot meet the product requirements in actual production.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a light-curing thermal-curing resin composition, and resin film, insulation film and a circuit board which are prepared by the resin composition. The light-curing thermal-curing resin composition comprises (A) an oligomer resin, (B) a photopolymerization initiator, (C) an epoxy resin, (D) an acrylic acid monomer and (E) an inorganic filling material, wherein the skeleton of the oligomer resin comprises block-type carbamate bonds and polyimide bonds, and the tail end of the oligomer resin comprises unsaturated bonds. The resin composition has good flexibility, excellent electrical insulating properties, excellent tin-scolding heat resistance, enough organic solvent resistance, and enough acid and alkali resistance. The resin composition has photonasty, and therefore the resin composition has good processing precision and dimension stability after exposure and development by a weak alkaline aqueous solution.

Description

technical field [0001] The present invention relates to the field of materials, in particular to photocurable and / or thermosetting resin compositions used in the manufacture of circuit boards, insulating materials and circuit boards using such materials. Background technique [0002] In recent years, with the rapid development and progress of semiconductor components, there is a tendency for electronic equipment to be smaller, lighter, more functional, and more multifunctional. In line with these trends, the density of printed circuit boards has continued to increase. A high-density printed circuit board is a structural component formed of insulating materials supplemented by conductor wiring. When the final product is made, integrated circuits, transistors, diodes, passive components (such as: resistors, capacitors, connectors, etc.) and various other electronic components will be installed on it. Through the connection of wires, electronic signal connection and correspon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/027H05K1/02
Inventor 金行洲刘小棣
Owner SHANGHAI FUSAITE NEW MATERIAL
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap