Automatic pillar planting and welding device for ceramic pillar grid array packaging
A technology of a ceramic column grid array and a welding device is applied in the field of welding devices, automatic column planting and welding devices of a ceramic column grid array package (CCGA), and can solve the requirements that affect the progress of chip testing, cannot meet the requirements of batch production, and can not be welded. It is difficult to guarantee the quality of the column, so as to achieve the effect of reliable production quality, stable and reliable solder joints, and reduction of solder column damage.
Active Publication Date: 2016-04-27
WUXI ZHONGWEI GAOKE ELECTRONICS
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Problems solved by technology
[0002] At present, the efficient installation method of soldering pillars in the form of ceramic column grid array packaging is still blank in China. Most of the existing ones are completed by simple carrier-assisted manual placement. It usually takes 2-3 hours to complete the installation of a chip's solder post, which cannot meet the requirements of mass production at all, and also seriously affects the scheduled test progress requirements of the chip; and it is difficult to ensure the quality of the solder post in the process of manual placement, and the appearance of the solder post often appears Damage, deformation, etc.
Method used
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Embodiment Construction
[0013] The present invention will be further described below in conjunction with specific drawings.
[0014] Such as Figure 1 ~ Figure 4 As shown: the automatic pillar planting and welding device for ceramic pillar grid array packaging includes a buckle 1-1, a ring 1-2, a pillar holding block 2, a pillar guide block 3, and a guide hole 3-1 , screw 4, welding post positioning block 5, positioning hole 5-1, vacuum chamber base 6, positioning pin 7, shell positioning carrier 8, etc.
[0015] Such as figure 1 As shown, the present invention includes a vacuum chamber base 6, a vacuum chamber is provided on the vacuum chamber base 6, and a welding post positioning block 5, a welding post guide block 3 and a welding post holding block 2 are sequentially arranged on the vacuum chamber The positioning pin 7 is set on the vacuum cavity base 6, the vacuum cavity base 6 and the welding column positioning block 5, the welding column guide block 3 and the welding column holding block 2 a...
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The invention relates to an automatic column mounting and welding device for ceramic column grid array packaging. The automatic column mounting and welding device is characterized in that the automatic column mounting and welding device comprises a vacuum cavity base, a vacuum cavity is arranged on the vacuum cavity base, and a welding column locating block, a welding column guide block and a welding column containing block are sequentially arranged on the vacuum cavity; a locating pin is arranged on the vacuum cavity base, the vacuum cavity base is connected with the welding column locating block, the welding column guide block and the welding column containing block through the locating pin, and the welding column guide block is fixedly connected with the welding column containing block through screws; a welding column containing cavity is arranged on the welding column containing block, guide holes are formed in the welding column guide block, and locating holes which are in one-to-one correspondence to the guide holes are formed in the welding column locating block; the locating holes are stepped holes, and the hole diameter of the lower portion of each locating hole is smaller than that of the upper portion of the locating hole; hasps are arranged on the two sides of the vacuum cavity base, and hoops are arranged on the two corresponding sides of the welding column containing block. The automatic column mounting and welding device can improve productivity and quality.
Description
technical field [0001] The invention relates to a device for welding after placing a welding post on a pad position of a carrier, in particular to an automatic post planting and welding device for ceramic column grid array packaging (CCGA), which belongs to the technical field of microelectronic packaging. Background technique [0002] At present, the efficient installation method of soldering posts in the form of ceramic column grid array packaging in China is still blank, and most of the existing ones are completed by simple carrier-assisted manual placement. It usually takes 2-3 hours to complete the solder post installation of a chip, which cannot meet the requirements of mass production at all, and also seriously affects the scheduled test progress requirements of the chip; and it is difficult to ensure the quality of the solder post in the process of manual placement, and the appearance of the solder post often appears damage, deformation, etc. Contents of the invent...
Claims
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IPC IPC(8): H01L21/50H01L21/67H01L21/68
CPCH01L24/10H01L24/11H01L24/17
Inventor 李耀张国华张浩
Owner WUXI ZHONGWEI GAOKE ELECTRONICS