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Flexible base plate

A flexible substrate and seed layer technology, applied in the field of flexible substrates, can solve problems such as copper foil layer warping and insufficient adhesion

Inactive Publication Date: 2014-02-19
LIYANG DONGDA TECH TRANSFER CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are still many problems in the manufacturing method by adhesive, such as insufficient adhesion to cause warping of the copper foil layer

Method used

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  • Flexible base plate

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Embodiment Construction

[0008] refer to figure 1 , the flexible substrate proposed by the present invention includes: polyimide 1, seed layer 2 and copper foil layer 3; the flexible substrate also has a via hole 4 penetrating the polyimide board, wherein the seed layer 2 forms On the upper and lower surfaces of the polyimide board 1 and the sidewall of the via hole 4; wherein, the copper foil layer 3 is formed on the seed crystal layer 2 of the polyimide board 1 and the seed crystal on the sidewall of the via hole 4 layer;

[0009] Wherein, the material of the seed layer 2 is that the seed layer is nickel-chromium alloy (Ni-Cr), copper (Cu) or nickel (Ni), and its thickness is 800-1000 angstroms; the aperture range of the via hole is 50-70 microns .

[0010] The following describes the manufacturing method of the flexible substrate proposed by the present invention, which includes the following steps in turn:

[0011] (1) forming a via hole 4 in the polyimide board 1,

[0012] (2) Form the seed l...

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Abstract

The invention discloses a flexible base plate. The flexible base plate comprises a polyimide plate, crystal seed layers and copper foil layers. The flexible base plate further comprises a pass hole penetrating through the polyimide plate, wherein the crystal seed layers are formed on the upper surface and the lower surface of the polyimide plate 1 and the lateral wall of the pass hole, and the copper foil layers are formed on the crystal seed layers of the polyimide plate and the crystal seed layer on the lateral wall of the pass hole.

Description

technical field [0001] The invention relates to the field of printed substrates, in particular to a flexible substrate. Background technique [0002] A flexible printed circuit board (FPCB) is widely used in portable electronic devices due to its special bendable properties. [0003] Currently, flexible printed substrates are manufactured by using flexible copper clad laminates as substrate materials. The flexible copper clad laminate is formed by pasting the copper foil layer on the surface of the polyimide film and patterning the copper foil layer to form a circuit pattern structure. In the prior art, the manufacturing method mainly uses polyimide film, adhesive and copper foil to be stacked in sequence to form a three-layer structure, wherein the polyimide film and copper foil are attached to each other by adhesive. However, there are still many problems in the manufacturing method by the adhesive, such as insufficient adhesive force resulting in warping of the copper f...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/09H05K1/11
Inventor 丛国芳
Owner LIYANG DONGDA TECH TRANSFER CENT