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Method for plating insulating thermal conductive plate with copper

A technology of insulation and heat conduction and copper plating, which is applied in the direction of improving the metal adhesion of insulating substrates, plating and coating of superimposed layers, and can solve problems such as waste water and gas

Inactive Publication Date: 2014-02-19
LIYANG JIANGDA TECH TRANSFER CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method requires the use of a large amount of adhesives, and the adhesives usually cause environmental problems such as waste water and waste gas.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Introduce the first embodiment of the present invention below; The method that the present invention proposes on the copper plating on the insulating heat-conducting plate comprises the following steps successively:

[0017] (1) Provide heat-conducting metal substrate;

[0018] (2) Prepare a thermally conductive insulating layer, and uniformly mix metal nitride nanoparticles into the thermally conductive insulating layer:

[0019] (3) Coating a heat-conducting insulating layer on a heat-conducting metal substrate, and then irradiating the surface of the above-mentioned heat-conducting insulating layer with an ultraviolet laser, thereby activating the metal nitride nanoparticles therein;

[0020] (4) A copper plating layer is formed on the activated thermally conductive insulating layer.

[0021] Among them, between steps (1) and (2), the heat-conducting metal substrate is cleaned for the first time, for example, the pollutants on the surface of the heat-conducting meta...

Embodiment 2

[0028] Provide the most preferred embodiment of the present invention in the second embodiment below, the method that the present invention proposes on the copper plating on the insulating heat-conducting plate comprises the following steps successively:

[0029] (1) Provide heat-conducting metal substrate;

[0030] (1-1) Clean the thermally conductive metal substrate for the first time, such as cleaning the pollutants on the surface of the thermally conductive metal substrate by rinsing with deionized water or ultrasonic oscillation cleaning, and drying the thermally conductive metal substrate with clean hot air after cleaning;

[0031] (2) Prepare a thermally conductive insulating layer, and uniformly mix metal nitride nanoparticles into the thermally conductive insulating layer:

[0032] (3) Coating a heat-conducting insulating layer on a heat-conducting metal substrate, and then irradiating the surface of the above-mentioned heat-conducting insulating layer with an ultravi...

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Abstract

The invention discloses a method for plating an insulating thermal conductive plate with copper. The method sequentially includes the following steps of firstly, providing a thermal conductive metal substrate; secondly, preparing a thermal conductive insulating layer, and evenly mixing the thermal conductive insulating layer with nitride metal nanometer particles; thirdly, coating the thermal conductive metal substrate with the thermal conductive insulating layer, and then irradiating the surface of the thermal conductive insulating layer through ultraviolet lasers, thereby activating the nitride metal nanometer particles in the thermal conductive insulating layer; fourthly, forming a copper coating on the activated thermal conductive insulating layer.

Description

technical field [0001] The invention belongs to the field of circuit boards, and in particular relates to a copper plating method capable of enhancing the bonding force between a copper plating layer and an insulating heat conducting plate. Background technique [0002] Copper plated sheet is the main material used to form printed circuit boards. At present, in the fields that require high heat dissipation, the industry uses copper plating on insulating heat-conducting plates, and uses them as substrates to make printed circuit boards with conductive patterns. The copper plating method on the insulating heat-conducting board is as follows: firstly, a heat-conducting insulating layer is formed on the heat-conducting metal substrate, and then copper is directly plated on the heat-conducting insulating layer. In this method, since the copper plating layer is directly formed on the thermally conductive insulating layer, the thermally conductive insulating layer is generally mad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38C23C28/00
Inventor 张翠
Owner LIYANG JIANGDA TECH TRANSFER CENT