A non-resonant three-dimensional elliptical diamond vibration cutting flexible device

A technology of vibration cutting and flexible devices, which is applied in the field of ultra-precision cutting and processing of complex optical parts of difficult-to-machine materials, can solve the problems of high processing frequency, easy coupling of driving, and increased difficulty of control, etc., and achieves easy high-frequency The processing, the overall structure is simple, the effect of high control precision

Active Publication Date: 2015-08-12
长春博信光电子有限公司
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Problems solved by technology

[0008] The most prominent feature of the resonance vibrating cutting device is the high processing frequency. According to the available literature, the maximum processing frequency can reach 60KHZ. The biggest disadvantage is that the device relies on its own natural frequency for resonance processing, resulting in a high processing frequency. It cannot be adjusted, and the driving between each mode is prone to coupling, and the difficulty of control is increased. Therefore, the current non-resonant processing device is gradually welcomed by researchers. Currently, there are two parallel or two parallel EVC non-resonant devices. The disadvantage of the vertical configuration method is that the generated elliptical plane is fixed, and there are certain limitations for the processing of complex curved surfaces. On this basis, the non-resonant three-dimensional elliptical vibration cutting overcomes all the above shortcomings, but the non-resonant three-dimensional research, a breakthrough is still needed
[0009] At present, the existing non-resonant three-dimensional elliptical cutting device patents can be checked: a kind of mixed-frequency three-dimensional elliptical vibration cutting method mentioned in the patent (CN102078967A), the diamond tip can generate three-dimensional elliptical motion trajectory in space, but its piezoelectric stack Due to the limitation of the stack position, the three-dimensional elliptical motion trajectory generated by it can only be on one side of the diamond tool, which has certain limitations.
The three-dimensional elliptical cutting device mentioned in the patent (CN102059575A) also can only be on one side of the diamond tool, and the parameter adjustment range is limited. It has high requirements for matching machine tools and is not universal.

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  • A non-resonant three-dimensional elliptical diamond vibration cutting flexible device
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  • A non-resonant three-dimensional elliptical diamond vibration cutting flexible device

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Embodiment Construction

[0030] The upper flexible hinge 2 is vertically assembled with the lower flexible hinge 3, wherein the upper flexible hinge 2 is connected to the lower flexible hinge hole 1 305 and the upper flexible hinge hole 2 205 of the lower flexible hinge 3 by screws respectively through the upper flexible hinge hole 1 202 and the upper flexible hinge hole 2 205. On the lower flexible hinge connecting hole 2 307, the piezoelectric stack 1 101 and the piezoelectric stack 2 103 are preloaded and installed on the lower flexible hinge 3 through the pre-tightened threaded hole 1 301 and the pre-tightened thread 2 303 respectively by bolts. Stack three 102 is preloaded and installed on the upper flexible hinge 2 through the pre-tightened threaded hole three 201 by bolts, and the diamond tool 4 is installed on the threaded hole 203 of the upper flexible hinge 2 by bolts.

[0031] The individual hinges in the upper flexible hinge 2 of the present invention are all straight circular hinges, and t...

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Abstract

The invention relates to a non-resonant three-dimensional elliptical diamond vibration cutting flexible unit and belongs to the technical field of super-precision cutting and machining of complex optical parts of materials difficult to machine. An upper flexible hinge and a lower flexible hinge are fitted in the vertical direction. The upper flexible hinge is connected to a first lower flexible hinge connecting hole and a second lower flexible hinge connecting hole of the lower flexible hinge respectively through a first upper flexible hinge connecting hole and a second upper flexible hinge connecting hole. A first piezoelectric stack and a second piezoelectric stack are mounted on the lower flexible hinge respectively through a first pre-tightening threaded hole and a second pre-tightening threaded hole. A third piezoelectric stack is mounted on the upper flexible hinge in a pre-tightened manner through a third pre-tightening threaded hole. A diamond tool is mounted on the threaded holes of the upper flexible hinge through bolts. The non-resonant three-dimensional elliptical diamond vibration cutting flexible unit has the advantages that elliptical path of a tip of the diamond tool in any spatial plane can be accurately realized, parameter regulation range is wide, and the flexible unit is applicable to any machine tool and has certain universality.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision cutting and complex optical parts processing of difficult-to-machine materials, and in particular relates to a non-resonant three-dimensional elliptical vibration cutting flexible device. Background technique [0002] With the rapid development of science and technology, in recent years, the requirements for processing accuracy in some high-precision parts processing fields have become higher and higher. Diamond tools have made important contributions to the processing of high-precision parts, but due to the limitations of traditional processing technology, for The precision machining of difficult-to-machine materials urgently needs a breakthrough in the processing method. Vibration cutting is based on this need. Vibration cutting uses the vibration in the processing process to effectively avoid the rapid wear of diamond tools and prolong the tool life. Improved machining accuracy. [000...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23D79/00
Inventor 林洁琼卢明明周晓勤王荣奇
Owner 长春博信光电子有限公司
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