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High-heat-conduction insulating glue for aluminum substrate and preparation method thereof

A technology of high thermal conductivity and insulating adhesive, which is applied in the direction of adhesives, epoxy resin adhesives, non-polymer adhesive additives, etc., can solve the problems of unguaranteed quality and inability to break through the thermal conductivity of the insulating layer, and achieve the effect of improving the thermal conductivity

Inactive Publication Date: 2015-07-15
HUIZHOU CITY GREEN MARK PHOTOELECTRIC TECH
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AI Technical Summary

Problems solved by technology

At present, the difficulty in the domestic industry is that the thermal conductivity of the insulating layer cannot be broken through, and its quality cannot be guaranteed

Method used

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  • High-heat-conduction insulating glue for aluminum substrate and preparation method thereof
  • High-heat-conduction insulating glue for aluminum substrate and preparation method thereof
  • High-heat-conduction insulating glue for aluminum substrate and preparation method thereof

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below.

[0022] The high thermal conductivity insulating glue for the aluminum substrate of the embodiment of the present invention is composed of the following components according to the mass percentage: 45% of improved epoxy resin; 45.5% of mixed thermal conductive filler; 5% of dicyandiamide curing agent; 2% of dimethylimidazole; liquid silica gel 2.5%.

[0023] The preparation method of the aluminum substrate high thermal conductivity insulating glue is as follows:

[0024] (1) Mix 40-60% of nano-alumina, 30-50% of nano-aluminum nitride, and 5-10% of nano-diamond powder, add acetone at a total mass ratio of 1:3, and put them into a grinder for grinding 2 hours to make a mixed thermal conductive filler;

[0025] (2) Under the conditions of -0.08MP vacuum degree and 300 rpm rotation speed, add 45% epoxy resin, 2....

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Abstract

The invention relates to the technical field of insulating materials and particularly relates to high-heat-conduction insulating glue for an aluminum substrate. The high-heat-conduction insulating glue contains the following ingredients in percentage by weight: 40-50% of modified epoxy resin, 40-50% of mixed heat conducting filler, 3-7% of curing agent, 1-3% of accelerating agent and 2-5% of liquid-state silica gel. According to the high-heat-conduction insulating glue disclosed by the invention, based on the mixing of heat conducting fillers of different varieties, specifications and sizes, the fillers are subjected to compatibility surface treatment under given process conditions, so as to increase the coefficient of heat conductivity of the fillers, and then, the treated fillers are uniformly dispersed into an epoxy resin matrix, so that the coefficient of heat conductivity of the insulating glue is increased greatly.

Description

technical field [0001] The invention relates to the technical field of insulating materials, in particular to a high thermal conductivity insulating adhesive for aluminum substrates and a preparation method thereof. Background technique [0002] With the popularization and wide application of electronic products, the production and manufacturing technology of metal-based LED circuit boards is also constantly updated and developed. For the development and demand of heat dissipation for different electronic products, the core technology depends on the thermal conductivity of the insulating layer. At present, the domestic technology is still in the development stage. With the wide application and improvement of products, the product requirements are becoming more and more stringent. Therefore, the only way to update and improve the technology is to break through. The thermal conductive adhesive has many advantages over other heat dissipation methods. It is not only better than t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J183/04C09J11/04C09J11/06C09J7/00
Inventor 邵国生
Owner HUIZHOU CITY GREEN MARK PHOTOELECTRIC TECH
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