A method for reducing impurity particles in low-pressure furnace tubes

Abstract

The invention discloses a method for reducing impurity particles in a low-pressure furnace tube. Specifically, the temperature of the low-pressure furnace tube is raised and lowered. The method of passing constant pressure cleaning gas in time to achieve the purpose of improving the condition of the low-pressure furnace tube particles, thereby reducing the impurity particles generated during the low-pressure furnace tube process, especially reducing the impurity particles on the inner wall of the furnace tube. The method of the present invention can effectively improve the condition of impurity particles in the low-pressure furnace tube. Compared with the same deposition process, the wafer-controlled impurity particles produced by it are significantly reduced, which solves the problem caused by the residual impurity particles after multiple deposition processes. To solve the problem of product defects, extend the batches of safe and stable operation of low-pressure furnace tubes, improve the stability of related diffusion processes, reduce the impact of defects on products, and improve production efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for reducing impurity particles in a low-pressure furnace tube. Background technique [0002] Today's semiconductor manufacturing process requires higher and higher precision, so it requires the integration of chips to increase and the size of devices to shrink. In the furnace tube diffusion process (such as AA-SINdeposition, Spacerdeposition, Polydeposition), the particles remain on the gas pipeline and the inner wall of the furnace tube. When working in multiple batches for a long time, it will increase the impurity particles falling to the wafer during the process Due to the above possibility, the introduction of pollution sources such as particles in the wafer production process may cause open circuit or disconnection of the circuit, resulting in product defects, thereby affecting the manufacture of devices in subsequent processes. Therefore, the...

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Problems solved by technology

This patent mainly realizes the cleaning function by utilizing the strong cleaning force of the cleaning gas on the impurity particles under a certain pressure, but in this patent, more cleaning gas and greater pressure are required to achieve effective cleaning effect, higher requirements for equipment and processes, which is not conducive to the widespread use of cleaning methods

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