Method for decreasing impurity particles in low pressure furnace tube

Abstract

The invention discloses a method for decreasing impurity particles in a low pressure furnace tube. Specifically, heating-cooling treatment is carried out on the low pressure furnace tube, the temperature of the low pressure furnace tube, the heating-cooling rate and the gas type are controlled, and a constant pressure cleaning gas is introduced according to certain interval time and cleaning time so as to reach the purpose of improving low pressure furnace tube particle status, thereby reducing the impurity particles generated in a low pressure furnace tube process, especially reducing the impurity particles on the furnace tube inner wall. The method provided by the invention can effectively improve the impurity particle status of the low pressure furnace tube, and compared with a similar deposition process, the produced wafer control piece impurity particles are significantly decreased, thus solving the product defect problem caused by the impurity particles remaining after multiple deposition processes, prolonging the safe and stable operation batch of the low pressure furnace tube, improving the stability of a relevant diffusion technology, reducing the defect influence on the product, and enhancing the production efficiency.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for reducing impurity particles in a low-pressure furnace tube. Background technique [0002] Today's semiconductor manufacturing process requires higher and higher precision, so it requires the integration of chips to increase and the size of devices to shrink. In the furnace tube diffusion process (such as AA-SIN deposition, Spacer deposition, Poly deposition), the particles remain on the gas pipeline and the inner wall of the furnace tube. When working in multiple batches for a long time, it will increase the drop of impurity particles during the process The possibility of contamination on the wafer, the introduction of pollution sources such as particles during the wafer production process, may cause open or disconnected circuits, resulting in product defects, thereby affecting the manufacture of devices in subsequent processes. Therefore, the in...

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Problems solved by technology

This patent mainly realizes the cleaning function by utilizing the strong cleaning force of the cleaning gas on the impurity particles under a certain pressure, but in this patent, more cleaning gas and greater pressure are required to achieve effective cleaning effect, higher requirements for equipment and processes, which is not conducive to the widespread use of cleaning methods

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