Method for controlling adsorption heat pump, information processing system, and control device
An information processing system and adsorption heat pump technology, applied in the direction of adsorption machines, refrigerators, refrigeration components, etc., can solve the problem of data center consumption and other issues
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[0050] figure 2 It is a schematic diagram explaining the control method of the adsorption-type heat pump of embodiment. In addition, this embodiment also refers to figure 1 to explain.
[0051] Such as figure 1 As shown, the adsorption heat pump 10 has an evaporator 11, a condenser 12, and adsorbers 13a, 13b. A cooling water coil 11 a is arranged in the evaporator 11 , and a cooling water coil 12 a is arranged in the condenser 12 . Moreover, the heat transfer pipe 14 and the adsorbent 15 are respectively arrange|positioned in the adsorber 13a, 13b.
[0052] Such as figure 2 As shown, the cooling water coil 11 a of the evaporator 11 of the adsorption heat pump 10 is connected to the evaporator cooling water flow path 21 . A cooling water storage tank 31 for storing cooling water and a pump 32 for circulating cooling water between the cooling water storage tank 31 and the evaporator 11 are provided on the evaporator cooling water passage 21 . The cooling water stored in...
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[0103] Next, results obtained by experimentally confirming the effect of the method for controlling the adsorption heat pump according to the embodiment will be described.
[0104] Figure 9 It is a schematic diagram explaining the apparatus used in the experiment. in the Figure 9 in, right with figure 2 Identical components are marked with the same reference numerals. A refrigeration unit 51 is arranged on the evaporator cooling water flow path 21 to replace figure 2 The cooling water storage tank and the pump 32 are illustrated. Assuming that the set temperature TL of the refrigeration unit 51 is 18°C, the set temperature T of the refrigeration units 33 and 35 M is 25°C.
[0105] In addition, in the experiment, one server 53 (RX300S6 manufactured by Fujitsu Corporation) and two analog servers 54 were used as electronic devices. Two CPUs 55 are installed on the server 53 , and cooling plates are respectively installed on the two CPUs 55 , and heat medium is discharg...
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