Laser cutting preprocessing device, laser cutting device and laser cutting method

Abstract

The invention provides a laser cutting pretreatment device and a laser cutting device and method. The laser cutting pretreatment device is used for conducting partial heating treatment on a workpiece to be cut, wherein the workpiece to be cut is placed on a workbench. The laser cutting pretreatment device comprises a heating laser generator, a heating laser beam position adjusting module and an industrial personal computer, wherein the heating laser generator is used for generating a heating laser beam, the heating laser beam position adjusting module is used for adjusting the incidence position of the heating laser beam on the workpiece to be cut, and the industrial personal computer is used for controlling the heating laser beam position adjusting module to conduct adjustment operation according to a cutting area on the cut surface of the workpiece to be cut of the cutting laser beam of the cutting laser generator. The invention further provides the laser cutting device and method. According to the laser cutting pretreatment device and the laser cutting device and method, through the arrangement of the corresponding pretreatment device, the internal stress inside the workpiece to be cut can be effectively eliminated, and the yield of cut products is improved.

Description

technical field [0001] The invention relates to the field of laser cutting, in particular to a laser cutting pretreatment device, a laser cutting device and a laser cutting method. Background technique [0002] As the scope of laser processing applications continues to expand, the types of materials that can be cut by lasers are increasing, and a large part of them are thermoplastic polymer materials. figure 1 11 is the laser beam, 12 is the volatilized plasma, 13 is the plasma excited on the surface of the material, 14 is the liquid phase region of the material, and 15 is the solid phase region of the material. figure 2 It is a schematic diagram of the internal stress in the material without processing. [0003] like figure 1 and figure 2 As shown, where A is the direction of strong force, B is the direction of weak force, and C is the direction of strain generation. When processing materials, since the material itself has carbon / silicon ultra-long molecular chains, t...

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Problems solved by technology

[0008] The purpose of the embodiments of the present invention is to provide a laser cutting pretreatment device, a laser cutting device and a laser cutting method to solve the technical problem of the high defective rate of cutting products of the laser cutting device in the prior art

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