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Intelligent dual interface card chip contact solder wetting and hot melt adhesive pasting automation device

A technology of contact point tin and dual-interface card, which is applied in the direction of recording carriers used in machines, instruments, computer parts, etc., can solve problems such as slow speed, and achieve the effect of improving production speed and product quality

Active Publication Date: 2014-03-26
ESIM TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to propose a dual-interface card with fast speed, simple card manufacturing process and good quality due to the slow speed of the existing double-sided interface card manufacturing process. Melt automatic production equipment

Method used

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  • Intelligent dual interface card chip contact solder wetting and hot melt adhesive pasting automation device
  • Intelligent dual interface card chip contact solder wetting and hot melt adhesive pasting automation device
  • Intelligent dual interface card chip contact solder wetting and hot melt adhesive pasting automation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] see Figure 5 , the dual-interface card chip contact point tin, sticky hot melt adhesive automatic production equipment that provides in the figure includes a frame 100, and a workbench 110 is arranged in the middle of the frame 100, and the workbench 100 divides the frame 100 into The upper and lower parts; the bottom of the frame 100 is provided with adjustable support feet 120 . In addition, an operation window 130 is provided on the frame at the top of the workbench 110 , and a door 140 that can cover the operation window 130 is hinged at the top of the frame 100 .

[0044] A chip contact tinning mechanism 200 is installed on the left side of the workbench 110 , and a chip strip feeding mechanism 300 is installed in the lower frame 100 of the workbench 110 on this side.

[0045] Chip contact point tin mechanism 200 comprises tin wire rack 210, tin wire feeding device 220 and chip pin tin coating device 230, and tin wire wheel 240 is shelved on tin wire rack 210, an...

Embodiment 2

[0055] The difference between this embodiment and Embodiment 1 is that the structure of the chip contact tinning mechanism 200 is different. The chip contact tinning mechanism 200 includes a tin melting device 210a, a chip pin tin coating device 220a and a tin coating quality detection device 230a.

[0056] The chip strips sent by the chip strip feeding tray 310 enter the chip pin tin coating device 220a for tinning, and the chip strips after tinning are sent to the tin coating quality inspection device 230a, and the tin coating quality inspection The device 230a checks the quality of the tin coating on the chip strip, and sends it to the tin melting device 210a to fix the tin coating after the inspection.

[0057] The other structural domains of this example are the same as Example 1.

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PUM

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Abstract

The invention discloses an intelligent dual interface card chip contact solder wetting and hot melt adhesive pasting automation device. The device comprises: a working bench arranged on the middle portion of a rack; a chip contact solder wetting mechanism arranged on one side of the table of the working bench and a hot melt adhesive pasting mechanism arranged on the other side of the table of the working bench; a chip strip feeding mechanism arranged on one side of the lower portion of the working bench and a chip strip receiving mechanism arranged on the other side of the lower portion of the working bench, wherein the chip strip feeding mechanism is used to feed chip strips to the chip contact solder wetting mechanism, the chip contact solder wetting mechanism is then used to feed the chip strips to the hot melt adhesive pasting mechanism, and the chip strip receiving mechanism is used to roll up the chip strips fed out by the hot melt adhesive pasting mechanism; and a control device for controlling the operation of the chip strip feeding mechanism, the chip contact solder wetting mechanism, the hot melt adhesive pasting mechanism and the chip strip receiving mechanism. According to the invention, antennas, a conductive welding material and chip antenna pins are welded together, and welding can be completed by a chip binding material and a card-based welding element at a same device and a same workstation by using a same welding head to perform heating, so the production speed and the product quality can be greatly improved.

Description

technical field [0001] The invention relates to the technical field of intelligent dual-interface card manufacturing equipment, in particular to automatic equipment for tinning and sticking hot-melt glue on chip contacts of intelligent dual-interface cards. Background technique [0002] The dual-interface card is a card that combines the functions of a contact IC card and a contactless IC card. Contact IC cards are like telephone cards, which need to be inserted into the telephone before they can be used. A non-contact IC card is like a bus IC card. Its chip and antenna are inside the card. Because of the antenna, when taking a bus, you can swipe the card just by sensing it without touching it. The dual-interface card uses one chip for two functions, but it must be equipped with an antenna, and the antenna and the chip are connected. In this way, a dual-interface card is formed, which can be used on both contact and non-contact equipment. . [0003] At present, the proces...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07
Inventor 王峻峰张耀华王建
Owner ESIM TECH LTD