Manufacturing method for rigid substrate and flexible display device and rigid substrate

A technology of rigid substrate and fabrication method, applied in semiconductor/solid-state device manufacturing, electric solid-state device, semiconductor device, etc., can solve the problems of long etching time, poor selectivity, etching residue, etc., to shorten the etching time, The effect of improving the peeling effect

Active Publication Date: 2014-03-26
BOE TECH GRP CO LTD
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  • Claims
  • Application Information

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Problems solved by technology

However, because the gas etching method will cause damage to the performance of the entire device, the selectivity is usually poor; although the selectivity of wet etching is improved, but due to the planar combination between the rigid substrate and the flexible substrate, the solvent can only be removed from the substrate. Etching is carried out step by step from the surroundings to the center, resulting in a longer etching time, and it is also easy to cause etching residues

Method used

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  • Manufacturing method for rigid substrate and flexible display device and rigid substrate
  • Manufacturing method for rigid substrate and flexible display device and rigid substrate
  • Manufacturing method for rigid substrate and flexible display device and rigid substrate

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Embodiment Construction

[0043] The structure and principle of the present invention will be described in detail below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, not to limit the protection scope of the present invention.

[0044] Such as figure 1 As shown, a method for manufacturing a rigid base substrate is used for the manufacture of a flexible display device, comprising the following steps:

[0045] forming a permeable layer on the surface of the rigid substrate;

[0046] A channel structure is formed on the surface of the permeable layer.

[0047] The setting of the permeable layer with a channel structure allows the liquid for removing the sacrificial layer to quickly enter the interior of the permeable layer, contact the sacrificial layer to remove the sacrificial layer, increase the contact area between the sacrificial layer and the liquid used to remove the sacrificial layer, and shorten the sacrificial layer. The et...

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Abstract

The invention relates to a manufacturing method for a rigid substrate and a flexible display device and the rigid substrate. The manufacturing method for the rigid substrate used for manufacturing the flexible display device includes the following steps that a permeable layer is formed on the surface of the rigid substrate, and channel structures are formed in the surface of the permeable layer. The manufacturing method for the rigid substrate and the flexible display device has the advantages of shortening the etching time of a sacrificial layer and improving the stripping effect of a flexible substrate.

Description

technical field [0001] The invention relates to the field of flexible display manufacturing, in particular to a rigid substrate, a method for manufacturing a flexible display device, and a rigid substrate. Background technique [0002] Flexible organic light-emitting diode (FOLED) displays have more advantages than other flexible displays, such as self-luminous display, fast response speed, high brightness, wide viewing angle, and low cost. Moreover, FOLED displays are based on flexible organic materials, which can be rolled, folded, and even used as a part of wearable computers, so they have a very wide range of applications in special fields such as portable products with good display effects and military affairs. [0003] Traditional flexible displays mainly use flexible substrates with a thickness of less than 100 microns, such as ultra-thin glass, stainless steel films, and plastic substrates. Due to the problems of fragility, wrinkling and deformation of the flexible ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L27/32
CPCH01L21/02005H10K59/00H10K77/10H10K71/80H10K59/1201H10K71/00Y02E10/549Y02P70/50
Inventor 代青刘则侯文军
Owner BOE TECH GRP CO LTD
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