A method of manufacturing a flexible printed circuit board with a large-scale docking process
A technology for printed circuit boards and manufacturing methods, which is applied in the field of printed circuit board manufacturing, and can solve problems such as inability to apply high-speed transmission signals, power division signals, and large signal losses.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0041] The super-long flexible board splicing process 2 will be further explained below in conjunction with the accompanying drawings.
[0042] Cutting of flexible sheet materials: According to the design plan, the large materials A and B are cut into small materials a and b respectively, such as figure 1 , figure 2 shown;
[0043] Splicing of flexible sheets: according to the design plan, splicing small material a and small material b together, such as image 3 As shown; the edge of the splicing of the two plates is designed with an interface M for alignment, and the interface M can be cut out by mechanical or laser methods, such as Figure 4 As shown; After the small materials are aligned, press them on the non-circuit graphic surface of the board (high temperature and high pressure) or glue a layer of protective film 1. Bond the two small materials into one board, such as Figure 5 shown. Wherein the protective film 1 is a bendable and insulating material.
[0044] Us...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 