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A method of manufacturing a flexible printed circuit board with a large-scale docking process

A technology for printed circuit boards and manufacturing methods, which is applied in the field of printed circuit board manufacturing, and can solve problems such as inability to apply high-speed transmission signals, power division signals, and large signal losses.

Active Publication Date: 2016-09-28
GUANGZHOU JIESAI COMM PLANNING DESIGN INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The ultra-long flexible board connected by third-party connecting devices has a large signal loss at the connection, making it impossible to apply to products with high-frequency signals, high-speed transmission signals, and power division signals.

Method used

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  • A method of manufacturing a flexible printed circuit board with a large-scale docking process
  • A method of manufacturing a flexible printed circuit board with a large-scale docking process
  • A method of manufacturing a flexible printed circuit board with a large-scale docking process

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The super-long flexible board splicing process 2 will be further explained below in conjunction with the accompanying drawings.

[0042] Cutting of flexible sheet materials: According to the design plan, the large materials A and B are cut into small materials a and b respectively, such as figure 1 , figure 2 shown;

[0043] Splicing of flexible sheets: according to the design plan, splicing small material a and small material b together, such as image 3 As shown; the edge of the splicing of the two plates is designed with an interface M for alignment, and the interface M can be cut out by mechanical or laser methods, such as Figure 4 As shown; After the small materials are aligned, press them on the non-circuit graphic surface of the board (high temperature and high pressure) or glue a layer of protective film 1. Bond the two small materials into one board, such as Figure 5 shown. Wherein the protective film 1 is a bendable and insulating material.

[0044] Us...

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PUM

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Abstract

The invention discloses a large butt-joint flexible printed circuit board manufacturing method including the steps of cutting flexible plates, jointing the cut flexible plates, connecting to close circuits at the jointing positions by conductive materials, arranging joints for alignment at the edge of the jointing positions of the flexible plates, and pressing or gluing protective films on non-circuit pattern surfaces after jointing alignment of the flexible plates. Every two flexible plates are connected by the protective film, the circuit cut-off positions are closed by adhering, welding and coating of the conductive materials, (for example, the circuit cut-off positions are closed by welding copper foil in the same size of the circuit), the conductive materials having the same conductive parameters with the circuits can be selected to close the circuits, and thus loss-less transmission of signals is realized basically. The jointing method can be used for production of ultra-long flexible printed circuit boards and realizing circuit closing in a loss-less manner basically.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, and more specifically, to a method for manufacturing a flexible printed circuit board with a large-size docking process. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit, FPC; hereinafter referred to as flexible board), also known as flexible circuit board, flexible circuit board, flexible circuit board or soft board, is a special printed circuit board with Light, thin, soft and bendable. Restricted by raw material processing equipment, line exposure negative film processing equipment and processing technology, flexible boards are usually within 0.5 meters in length. In the communication industry, some specific components need to use ultra-long flexible boards with a length of more than 1 meter or even 2 meters. Due to the raw material processing equipment and circuit board exposure film manufacturing equipment, the length of the special f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/36
Inventor 陈翔侯金坤任安源任代学詹世敬
Owner GUANGZHOU JIESAI COMM PLANNING DESIGN INST CO LTD