Blind-hole-conduction double-sided circuit board and processing method thereof

A processing method and circuit board technology, which are applied in the directions of printed circuit components, the formation of electrical connection of printed components, and the electrical connection of printed components, etc., can solve the problems of reduced quality assurance factor, narrowed application range, and surface layer copper foil damage, etc. Achieve the effect of reducing production costs, reducing energy consumption, and enhancing electrical conductivity
CN102858087AInactive Publication Date: 2013-01-02吴η₯–
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
吴η₯–
Publication Date
2013-01-02
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention discloses a blind-hole conduction double-sided circuit board and a processing method thereof. The blind-hole conduction double-sided circuit board comprises a substrate layer, an upper circuit layer and a lower circuit layer, wherein the upper circuit layer and the lower circuit layer are integrally adhered on the upper side and the lower side of the substrate layer via adhesive layers, conduction blind holes are arranged on the substrate layer and the upper circuit layer above the lower circuit layer, and an electroplating conduction wall conducting the upper circuit layer and the lower circuit layer are electroplated along the wall surface of the conduction blind holes. The blind-hole-conduction double-sided circuit board realizing blind hole conduction by copper electroplating via electroplating has the advantages of simple structure, fine conduction performance, environment friendliness and the like. The invention further provides a processing method of the blind-hole conduction double-sided circuit board, and by the processing method, production efficiency is improved, energy source consumption is reduced, conductive performance is improved, cost is reduced, and besides, the processing method is fine in quality guarantee coefficient, convenience in operation and the like.
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Description

technical field

[0001] The invention relates to a double-sided circuit board, in particular to a blind-hole conduction double-sided circuit board and a processing method thereof. Background technique

[0002] Whether the traditional double-sided conduction circuit board is a flexible circuit board or a rigid circuit board, in its production process, mechanical drilling or laser drilling is generally used to drill conduction holes on the double-sided composite copper plate, and then pass through Blackening or electroless copper plating is applied to increase the copper thickness of the inner wall of the through hole to complete the conduction function. The process of this method has great environmental pollution. Traditional double-sided circuit boards that do not require copper plating and copper plating usually use conductive carbon Oil filling holes, conductive silver, copper paste filling holes and other forms complete the conduction function. However, although conductive...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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