Spin coater tray with protection structure
A technology for protecting structures and coating machines, which is applied to the device for coating liquid on the surface, coating, etc., and can solve problems such as insufficient suction at the vacuum suction port, poor uniformity of the photoresist film, and damage to the coating table. To achieve the effect of preventing backflow to the back of the silicon wafer, preventing glue dripping, and avoiding insufficient suction or clogging
Inactive Publication Date: 2014-04-02
NANTONG UNIVERSITY
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Problems solved by technology
[0002] The existing photoresist leveling table adopts the method of vacuum suction to absorb the silicon wafer, but the existing silicon wafer holder cannot effectively prevent the photoresist from penetrating into the vacuum suction port during the shaking process, such as figure 1 In the prior art shown, the silicon wafer is in direct contact with the vacuum suction port. During the high-speed rotation of the homogenizer, the photoresist is expanded into a thin film by the combined action of rotating centrifugal force and surface tension. The glue drops thrown out to the edge of the silicon wafer, due to the pressure difference between the edge of the silicon wafer and the suction port of the wafer table and the surface tension of the colloid, part of the glue droplets on the edge of the silicon wafer will be sucked into the vacuum suction piece along the back of the silicon wafer In the mouth, thereby blocking the vacuum suction port, resulting in insufficient suction of the vacuum suction port, resulting in poor uniformity of the photoresist film, and at the same time causing damage to the coating table
Method used
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[0016] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.
[0017] see figure 2 with image 3 , the embodiment of the present invention includes:
[0018] A glue leveling machine tray with a protective structure, comprising: a silicon wafer receiving platform 1, a vacuum suction sheet structure 2 and an umbrella-shaped protective structure 3; the silicon wafer receiving platform 1 includes: a silicon wafer bearing plane 10, a glue storage Groove 11 and boss 12, described silicon wafer bearing plane 10 is positioned at the upper end of described silicon wafer bearing platform 1, and described silicon wafer bearing plane 10 is a circular horizontal plane, and described glue storage tank 11 is along the si...
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The invention discloses a spin coater tray with a protection structure. The spin coater tray comprises a silicon chip bearing platform, a vacuum chip suction structure and an umbrella-shaped protection structure, wherein the silicon chip bearing platform comprises a silicon chip bearing plane, a glue storage tank and a lug boss; the vacuum chip suction structure comprises an upper end and a vacuum chip suction opening, and the vertical distance between the vacuum chip suction opening and the silicon chip bearing plane is larger than 3 mm; the umbrella-shaped protection structure is installed on the top of the lug boss and is located in the glue storage tank. By means of the manner, the spin coater tray disclosed by the invention can effectively protect the vacuum chip suction opening and prevent photoresist from being sucked into the vacuum chip suction opening so as to avoid insufficient suction force or blockage of the vacuum chip suction opening due to suction of the photoresist and avoid damage on a spin coating platform.
Description
technical field [0001] The invention relates to the field of glue spreader equipment, in particular to a glue spreader tray with a protective structure. Background technique [0002] The existing photoresist leveling table adopts the method of vacuum suction to absorb the silicon wafer, but the existing silicon wafer holder cannot effectively prevent the photoresist from penetrating into the vacuum suction port during the shaking process, such as figure 1 In the prior art shown, the silicon wafer is in direct contact with the vacuum suction port. During the high-speed rotation of the homogenizer, the photoresist is expanded into a thin film by the combined action of rotating centrifugal force and surface tension. The glue drops thrown out to the edge of the silicon wafer, due to the pressure difference between the edge of the silicon wafer and the suction port of the wafer table and the surface tension of the colloid, part of the glue droplets on the edge of the silicon wafe...
Claims
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Login to View More IPC IPC(8): B05C11/08B05C11/10
Inventor 花国然王强朱海峰徐影邓洁
Owner NANTONG UNIVERSITY