Device for measuring electrostatic adsorption force and desorption time of electrostatic chuck

Abstract

The invention relates to a device for measuring electrostatic adsorption force and desorption time of an electrostatic chuck, and aims at providing a device capable of being used for accurately measuring the electrostatic adsorption force intensity and the wafer desorption time of the electrostatic chuck. The device comprises a vacuum cavity, the electrostatic chuck (10), a measuring system (14) and a motive power system, wherein the electrostatic chuck is arranged in the vacuum cavity, the measuring system is arranged in the vacuum cavity and is positioned under the electrostatic chuck, the motive power system is arranged on the vacuum cavity, and the motive power system is used for driving the electrostatic chuck to move so that the measuring system and the electrostatic chuck generate relative movement. In the traditional measuring mode, the loss of the effective acting area of plasmas above a wafer is caused, so the electrostatic force measurement in the plasma environment is greater. The device has the advantages that a force sensor is arranged under the wafer, the defects of the traditional measuring mode are overcome, and the device can be widely applied to the test of semiconductor industry electrostatic chuck devices.

Description

technical field [0001] The invention relates to a device detection device in the semiconductor industry, in particular to a device for measuring the electrostatic adsorption force and desorption time of an electrostatic chuck in a semiconductor device. Background technique [0002] The electrostatic chuck is a core component in the integrated circuit (IC) manufacturing process. It uses the principle of electrostatic adsorption to adsorb the wafer to be processed on its surface and can control the temperature of the surface of the wafer by back blowing gas. It is widely used in etching (Etching). ), physical vapor deposition (PVD), chemical vapor deposition (CVD) and other processes. Compared with traditional mechanical chucks and vacuum chucks, electrostatic chucks have many advantages. It avoids irreparable damage to wafers caused by mechanical reasons such as pressure and collision during use of traditional mechanical chucks, reduces particle contamination, and increases ...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a measuring device for the electrostatic adsorption force and desorption time of the electrostatic chuck, which can accurately measure the desorption time and the electrostatic adsorption force of the electrostatic chuck. The electrostatic chuck measurement device has the disadvantages of low precision and cannot be applied to the plasma environment. A device for measuring electrostatic force by pulling down the wafer is provided. The structure is simple and reliable, and the degree of automation is high. The specific technical solution is as follows:

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