A filament electronic powder coating process and its conductive device
A technology of coating process and conductive device, which is applied in the field of filament electronic powder coating process and its conductive device, can solve the problems of inaccurate control of powder amount, loose electronic powder coating, easy powder formation, etc. Efficiency and stability, increase the amount of powder, increase the effect of service life
Active Publication Date: 2016-04-13
JIANGXI AOPU LIGHTING CO LTD
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Problems solved by technology
[0002] At present, the technical process adopted in the filament electronic powder coating process is a dip-coating electronic powder coating process, including electronic powder preparation, electronic powder grinding and filament coating electronic powder. It is a dip-coating electronic powder coating. The disadvantage is that the amount of powder applied is controlled by the change of the concentration of the electronic powder slurry, and the amount of powder applied cannot be accurately controlled; the coating of the electronic powder is loose and easy to fall off
[0003] fall; easy to appear powder phenomenon
Method used
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[0016] A filament electronic powder coating process, including electronic powder preparation, electronic powder grinding and lamp
[0017] Wire-coated electronic powder, such as figure 1 as shown,
[0018] 1) Electronic powder preparation: electronic powder preparation: including electronic powder and reagents, electronic powder press
[0019] 100 parts are calculated as barium carbonate 56%, strontium carbonate 31%, calcium carbonate 13%, the reagent is DMF dimethyl formamide, and the weight ratio of the electronic powder to the reagent is 2:1;
[0020] 2) Electronic powder grinding: 48 hours;
[0021] 3) Filament coated with electronic powder: A conductive device is provided on the electronic powder coating station to energize the filament when coating the electronic powder slurry.
[0022] The electrical conductivity of the electronic powder is 100 us / cm.
[0023] The voltage of the conductive device is controlled within 100V, and the current is controlled within 20mA. ...
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The invention provides a lamp-filament electron powder coating process and a conductive device thereof. The lamp-filament electron powder coating process comprises the steps of electron powder preparation, electron powder grinding and lamp-filament electron powder coating, wherein electron powder comprises barium carbonate, strontium carbonate and calcium carbonate; the electron powder is ground for 48 hours; lamp-filament electron powder coating is conducted, wherein the conductive device is arranged at an electron powder coating position so that a lamp filament can be powered on when coated with electron powder slurry. The conductive device of the lamp-filament electron powder coating process comprises a bottom board, the bottom board is connected with an air cylinder and a polished shaft through an insulating plate, an insulating connection plate is arranged at one end of the air cylinder and one end of the polished shaft, the insulating connection plate is provided with a cathode powering-on fork connected with the lamp filament, and the cathode powering-on fork is connected with a voltmeter, an amperemeter and a signal indication lamp. The lamp-filament electron powder coating process and the conductive device thereof have the advantages that the percent of pass of the lamp filament is high and stability is high, the amount of the powder added to the lamp filament is increased, the number of on-off times of an energy saving lamp is increased, and the service life of the energy saving lamp is prolonged.
Description
technical field [0001] The invention relates to a filament electronic powder coating process and a conductive device thereof. Background technique [0002] At present, the technical process used in the filament electronic powder coating process is a dip-coating electronic powder coating process, including electronic powder preparation, electronic powder grinding and filament coating electronic powder. It is a dip-coating electronic powder coating. The disadvantage is that the amount of powder applied is controlled by the change of the concentration of the electronic powder slurry, and the amount of powder applied cannot be accurately controlled; the coating of the electronic powder is loose and easy to fall off [0003] Falling; easy to appear powder phenomenon. For example, the amount of powder on the filament (23w) is 2mg, the one-time qualified rate of wick production is 88%, the aged yellow and black rate is 8‰, and the service life (Φ8mm5W) is 6000-8000h. Contents of...
Claims
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IPC IPC(8): H01J9/22
Inventor 徐金标李春凤吴益君李波毛夏刚
Owner JIANGXI AOPU LIGHTING CO LTD