Manufacturing method of substrate structure
A manufacturing method and substrate technology, which is applied in the fields of printed circuit manufacturing, electrical connection formation of printed components, electrical components, etc., can solve problems such as complex manufacturing steps, achieve the effect of reducing manufacturing process steps, reducing manufacturing costs, and being suitable for mass production
Inactive Publication Date: 2014-04-09
SUBTRON TECH
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Problems solved by technology
Although the through hole formed in this way has a smaller aperture, it needs to go through two steps of coating photoresist, exposure, development and etching to form the opening of the copper foil layer, so the manufacturing steps are more complicated.
Method used
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Embodiment Construction
[0034] Figure 1A to Figure 1E It is a schematic cross-sectional view of a manufacturing method of a substrate structure according to an embodiment of the present invention. According to the manufacturing method of the substrate structure of this embodiment, firstly, please refer to Figure 1A , a substrate 110 is provided, wherein the substrate 110 has a core layer 112 , a first copper foil layer 114 and a second copper foil layer 116 . In this embodiment, the core layer 112 has a first surface 111 and a second surface 113 opposite to each other, and a first copper foil layer 114 and a second copper foil layer 116 are located on the first surface 111 of the core layer 112 respectively. with the second surface 113 on. Here, the material of the core layer 112 is, for example, resin.
[0035] Next, please refer to Figure 1B , performing a surface treatment on the first copper foil layer 114 and the second copper foil layer 116 to form a first rough surface S1 and a second ro...
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Abstract
A manufacturing method of substrate structure is provided. A base material is provided. The base material having a core layer and a first and second copper foil layers located at first and second surfaces of the core layer is provided. A surface treatment is performed on the first and second copper foil layers so as to form first and second roughened surfaces. A laser beam is irradiated on the first roughened surface so as to form at least one first blind hole extending from the first copper foil layer to the second surface. An etching process is performed on the second copper foil layer so as to form at least one second blind hole extending from the second copper foil layer to the second surface. A conductive layer fills up a through hole defined by the first and second blind holes and covers the first and second copper foil layers.
Description
technical field [0001] The invention relates to a method for manufacturing a substrate structure, and in particular to a method for manufacturing a substrate structure with a through-hole structure. Background technique [0002] Today's multilayer circuit boards with at least two circuit layers usually have a conductive through hole structure, and the conductive through hole structure is electrically connected to two circuit layers of the multilayer circuit board, so that these circuit layers can be electrically sexual conduction. At present, most of the methods for forming the conductive via structure are to first form the through hole by mechanical and etching methods, and then complete the conductive via structure through a through hole electroplating process. [0003] Generally speaking, if the mechanical drilling method is used to form the through hole, the formed through hole has a large diameter and is not suitable for mass production. If the etching method is used ...
Claims
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IPC IPC(8): H05K3/42
CPCH05K3/0035H05K2203/1476H05K3/0038H05K3/42H05K3/427Y10T29/49165
Inventor 黄子威
Owner SUBTRON TECH