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Method for manufacturing printed circuit board

A printed circuit board and transfer circuit technology, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of increasing processing time, processing cost, and complicated embedded technology

Inactive Publication Date: 2014-04-16
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] As mentioned above, in the embedded process of forming grooves on the insulating layer and then forming circuit patterns, because the additional process of processing grooves on the insulating layer is added, the embedded process may be complicated, so the processing time and processing time may be increased. cost

Method used

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  • Method for manufacturing printed circuit board
  • Method for manufacturing printed circuit board
  • Method for manufacturing printed circuit board

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Embodiment Construction

[0030] The purpose, features and advantages of the present invention will be more clearly understood from the following detailed description of preferred embodiments in conjunction with the accompanying drawings. Throughout the drawings, the same reference numerals are used to designate the same or similar elements, and redundant descriptions are omitted. Moreover, in the following description, the terms "first", "second", "one side", "another side" and the like are used to distinguish a certain element from other elements, but the structures of these elements should not be understood as limited by terms. Also, in the description of the present invention, when it is determined that a detailed description of related art will make the gist of the present invention unclear, the description thereof will be omitted.

[0031] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0032] Figure 1 to Fi...

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Abstract

Disclosed herein is a method for manufacturing a printed circuit board including: preparing a carrier member including a metal layer and a transfer circuit pattern sequentially formed on one surface thereof; preparing a base substrate having an inner layer circuit; forming an insulating layer on the base substrate; disposing the carrier member so that the transfer circuit pattern faces the insulating layer; embedding the transfer circuit pattern in the insulating layer through a heating and compressing process; and removing the carrier member, wherein the metal layer has a melting point lower than that of the transfer circuit pattern.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2012-0114310, filed on October 15, 2012, entitled "Method for Manufacturing of Printed Circuit Board", the entire content of which application is incorporated into this application for reference. technical field [0003] The present invention relates to a method for producing printed circuit boards. Background technique [0004] Recently, with the development of the electronic industry, the demand for multifunctional and small-sized electronic components has rapidly increased. [0005] In order to follow this trend, it is also required to have high-density circuit patterns in printed circuit boards, and various methods have been devised and used to implement fine circuit patterns. [0006] A method for implementing a fine circuit pattern may be mainly classified into a semi-additive method (SAP) and an embedded process. Among them, in the case o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/20H05K3/18
CPCH05K3/4658H05K3/00Y10T29/49155
Inventor 李五熙
Owner SAMSUNG ELECTRO MECHANICS CO LTD