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Automatic tin adding mechanism

An automatic, tin bar technology, applied in coating, metal material coating process, hot-dip plating process, etc., can solve the problems of local temperature drop of tin furnace, uneven thickness of tin plating layer, unstable liquid level of tin furnace, etc. , to achieve the effect of reducing rework rate, improving qualification rate and reducing manpower

Active Publication Date: 2014-04-23
苏州赛历新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method has the following disadvantages: 1. The specifications of the products produced change frequently, and the production operators cannot adjust the amount of tin added in time, which will cause the liquid level of the tin furnace to be in a relatively unstable state
2. Due to the instability of the liquid level in the tin furnace, the thickness of the tinned layer will be uneven during the tinning process, which will increase the number of reworked products
3. During the period of time when tin is just added, because the tin bar needs to be melted, the local temperature in the tin furnace will drop, which will also lead to uneven thickness of the tin coating, thereby increasing the number of product reworks

Method used

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Embodiment Construction

[0015] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0016] The present invention is an automatic tinning mechanism, see figure 1 As shown, it is used for tinning of photovoltaic ribbon, a fixed bracket 1, a tin bar storage device 2, a temperature sensing device 3, a lifting slot 4 and a control adjustment device 5, the fixed bracket 1 is arranged above the tin furnace, and the tin bar The storage device 2, the lift tank 4 and the control and adjustment device 5 are arranged inside the fixed bracket 1, the control and adjustment device 5 is arranged on the back of the tin bar storage device 2, and the temperature sensing device 3 is arranged on the tin liquid in the tin furnace.

[0017] A tin bar retaining groove 6 is provided at the tail of the ...

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Abstract

The invention discloses an automatic tin adding mechanism which is used for tinning a photovoltaic solder strip and comprises a fixing bracket, a tin strip storage device, a temperature sensing device, a lifting tank and a control adjusting device, wherein the fixing bracket is arranged above a tin furnace; the tin strip storage device, the lifting tank and the control adjusting device are arranged in the fixing bracket; the control adjusting device is arranged on one side of the tin strip storage device; the temperature sensing device is arranged on the tin liquid in the tin furnace. According to the automatic tin adding mechanism disclosed by the invention, the height of the liquid surface in the tin furnace is observed by use of a temperature sensor and a temperature transmitter so as to accurately ensure that the height of the tin liquid in the tin furnace is kept in a stable state, the labor is reduced while an automation effect is realized, the rework rate of products is further reduced, and the qualified rate of the products is improved.

Description

technical field [0001] The invention relates to solar photovoltaic products, in particular to an automatic tinning mechanism in a photovoltaic ribbon tinning device. Background technique [0002] With the development and progress of society, automation and integration have gradually become the development trend, and manual labor and traditional operation methods have been gradually updated and eliminated. [0003] In solar photovoltaic modules, the tin-coated solder strips used to connect the cells in series, the tin-coated solder strips need to pass through the tin furnace when they are produced on the equipment, and the copper strips are coated with tin by the tin furnace to form the solder strips. The traditional way of adding tin is to calculate the amount of tin added within a certain period of time according to the number of meters of solder ribbon during the tin plating process. This method has the following disadvantages: 1. The specifications of the products produc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C2/08C23C2/14
Inventor 胡云宗李经泽何连生
Owner 苏州赛历新材料科技有限公司
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