Production technology of LED nixie tube connecting board

A production process and digital tube technology, applied in the direction of instruments, electrical components, circuits, etc., can solve the problems of low efficiency and high defect rate, and achieve the effect of flexible and simplified operation, improved production efficiency, and optimized process operation.

Inactive Publication Date: 2014-04-23
SHENZHEN GUOYEXING OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In summary, the purpose of the present invention is to solve the technical deficiencies of low efficiency and high defect rate of single-board crystal bonding, wire bonding, and testing operations, and proposes a production process for connecting LED digital tubes

Method used

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  • Production technology of LED nixie tube connecting board
  • Production technology of LED nixie tube connecting board
  • Production technology of LED nixie tube connecting board

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0011] The process of the present invention, from jumping PIN→pressing PIN→dipping tin→cleaning→solid crystal→wire bonding→testing, all adopts connecting board operation, on the one hand, the production efficiency of each process is improved, on the other hand, the PIN pin is deformed and the chip is erased , Collapsed aluminum wire and other bad problems have been effectively improved.

[0012] LED nixie tube connecting board production process is characterized in that described production process comprises the following steps:

[0013] A. Preliminary steps: After jumping PIN and pressing PIN on the connected PCB board, directly install the connected PCB board on the dipping tin fixture, and automatically dip tin with wave soldering. After dipping the connected PCB board, there is no need to divide the board, Use the cleaning basket to move it into the ultrasonic cleaning equipment for cleaning, and then bake it after cleaning; PIN jumping on the whole board is convenient and...

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Abstract

The invention relates to the technical field of LED nixie tube production technology, particularly to production technology of an LED nixie tube connecting board. The technical defects that single board die bonding, wire welding, and test operation are low in efficiency and high in reject radio are overcome. The production technology comprises the following steps: A. an early stage step: after PIN jumping and PIN pressing of a connecting board PCB, a tin dipped clamp is mounted on the connecting board PCB; B. a die bonding step: bonding an LED chip in a designated area of the connecting board PCB; C. a wire welding step: circuit connection between the LED chip and the connecting board PCB is established through a wire welding machine; D. an early stage detection step: defective positions on the connecting board are marked by a white oily pen; and E. a board division step: LED nixie tube lamp panel units on the connecting board PCB are separated and output. Compared with an original single board operating mode, 80% of bad circumstances of deformation of PIN needles, chip erasion, wire collapse and the like are reduced, and the production efficiency is improved by three to four times.

Description

technical field [0001] The invention relates to the technical field of LED digital tube production technology. Background technique [0002] At present, LED digital products are almost all single-board die bonding, wire bonding, and testing operations. Not only is the efficiency very low, but the defective rate of each process is also relatively high. During the pre-process operation, it is easy to cause the PIN pin to bend and deform, and the cleaning efficiency is low; during the die-bonding operation, picking and placing materials can easily cause the PIN pin to deform and the PCB board to be loaded unevenly. ;During wire welding operations, the efficiency of picking and placing materials is low, which may easily cause material overturning and poor line collapse; during pre-testing operations, single picking and placing of materials is very easy to knock over materials and collapse aluminum wires. Contents of the invention [0003] In summary, the purpose of the presen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/48
CPCG09F9/33
Inventor 吴铭李益民黄倍昌
Owner SHENZHEN GUOYEXING OPTOELECTRONICS TECH CO LTD
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