Process environmental pressure scheduling method based on material supply system model
A supply system and environmental pressure technology, applied in metal material coating process, gaseous chemical plating, coating, etc., can solve the problems of long duration, increased Particle interference, difficult to maintain pressure conditions, etc., and achieve the effect of stable pressure
Active Publication Date: 2014-04-30
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0008] ①. Since the reaction chamber environment pressure regulation and the microenvironmental pressure regulation subsystems respectively adjust the pressure, it is difficult to keep the chamber environment and the microenvironmental pressure consistent with indicators such as pressure conditions;
[0009] ②. Due to the long duration of pressure imbalance adjustment in the boat entry and exit stage, the introduction of Particle interference in the microenvironment and cavity increases
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[0027] Attached below Figure 2-5 , the specific embodiment of the present invention will be further described in detail.
[0028] It should be noted that, in the following embodiments, the environment pressure regulating system formed by the 300mm vertical LPCVD equipment during the boat-in and boat-out process stages is taken as an example for illustration.
[0029] see figure 2 , figure 2 It is a structural schematic diagram of a preferred embodiment of the material supply system of the present invention. As shown in the figure, the same as the prior art, the system usually includes a reaction chamber pressure environment adjustment module formed by the process material module and a microenvironment pressure adjustment module where the product delivery module is located, the reaction chamber pressure environment pressure adjustment module and The micro-environmental pressure environment pressure regulation modules include: flowmeters 12 and 13, pipelines, solenoid valv...
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The invention discloses a process environmental pressure scheduling method based on a material supply system model. The process environmental pressure scheduling method comprises the following steps: a transfer function reaction model is built according to the features of a material supply system; a reaction cavity in the boat enter-exit phase and the microenvironment are used as a whole to form a combined cavity, and a reference input deviation integration system is introduced to build an augmentation state equation; a system state feedback control law of the material supply system is obtained; a feedback control law parameter is obtained through the closed loop feature equation of the material supply system; according to the pressure difference of the microenvironment and the reaction cavity and the feedback control law parameter, the synchronous adjusting of a flow control mechanism is implemented for the reaction cavity and the microenvironment as a whole to realize the stable pressure of materials in the boat enter-exit phase. Therefore, the process environmental pressure scheduling method accesses a microenvironment adjusting module in a vacuum pump link, synchronously adjusts the reaction cavity in the boat enter-exit phase and the microenvironment as a whole, and realizes the stable pressure of the materials in the boat enter-exit phase through the closed loop state equation of the material pressure environment.
Description
technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, and more specifically, relates to a process environment pressure scheduling method based on a material supply system model. Background technique [0002] Low Pressure Chemical Vapor Deposition (LPCVD) is one of the methods widely used in semiconductor technology; Over steps) and high yield are favored, and become the main method for preparing SiNX thin films. [0003] The process steps of low-pressure chemical vapor deposition can be divided into several main stages such as film transfer, boat entry, main process, and boat exit. The process factors that affect the quality and properties of thin film deposition mainly include: chamber temperature, ambient pressure, material flow, and environmental particles (Particles). Among them, the environmental pressure conditions in the boat entry and exit stages are particularly important for reducing the impact of Particles on pr...
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IPC IPC(8): C23C16/52
Inventor 刘建涛钟结实王春洪徐冬
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD