High-heat radiation copper-based circuit board

A circuit board, high heat dissipation technology, applied in the direction of printed circuit components, etc., can solve the problem of insufficient heat conduction speed, and achieve the effect of fast heat dissipation speed and strong heat dissipation capacity

Inactive Publication Date: 2014-04-30
高德(苏州)电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing high heat dissipation copper-based circuit boards, although the insulating and heat-conducting layer is a special material, has certain thermal conductivity, but its thermal conductivity is definitely much worse than that of copper, and the temperature on the circuit layer is conducted to the base copper through the insulating and heat-conducting layer. layer, the speed of heat conduction is still not fast enough

Method used

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  • High-heat radiation copper-based circuit board
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0014] Example: see figure 1 , figure 2 Shown:

[0015] A copper-based circuit board with high heat dissipation, including a board body, which is composed of three layers of circuit layer 1, insulating and heat-conducting layer 2 and base copper layer 3, see figure 2 .

[0016] see figure 1 , the circuit layer 1 side surface of the board is provided with a reinforced heat dissipation area 4 that does not carry current, and a plurality of blind holes 5 along the thickness direction of the board are arranged in the enhanced heat dissipation area 4 . These blind holes 5 penetrate the circuit layer 1 and the insulating and heat-conducting layer 2, so that the bottom of the blind hole 5 is connected to the base copper layer 3; and, the wall and bottom of each blind hole 5 are covered with a copper plating layer 6, And the wiring layer 1 is connected to the base copper layer 2 through the copper plating layer 6, see figure 2 .

[0017] The blind holes 5 are preferably tiny ...

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PUM

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Abstract

The invention relates to a high-heat radiation copper-based circuit boar comprising a board body. The board body is formed by composition of a circuit layer (1), an insulated heat conduction layer (2), and a cooper base layer (3). The high-heat radiation copper-based circuit board is characterized in that reinforced heat radiation zones (4) without current flowing are arranged at the surface of one side of the circuit layer (1) of the board body; a plurality of blind holes (5) along the direction of the board thickness are arranged in each of the reinforced heat radiation zones (4); and the blind holes (5) punch the circuit layer (1) and the insulated heat conduction layer (2), so that the bottoms of the blind holes (5) are communicated with the cooper base layer (3). Moreover, copper-plated layers (6) cover the walls and the bottoms of all the blind holes (5); and the circuit layer (1) and the cooper base layer (3) are connected by the copper-plated layers (6). According to the invention, the heat of the circuit layer is directly conducted to the cooper base layer through the copper-plated layers in the blind holes, so that the heat radiation capabilities of the reinforced heat radiation zones are enhanced and the heat radiation speed is accelerated.

Description

technical field [0001] The invention relates to a circuit board, in particular to a copper-based circuit board with high heat dissipation. Background technique [0002] With the development of the electronic industry, the governments of various countries have stricter requirements on environmental protection, and the application of LEDs has become more and more extensive. High heat dissipation copper-based circuit boards are often used in LED modules. Due to the advantages of high heat dissipation, copper-based circuit boards can effectively transfer the heat energy of LEDs to the external environment, while reducing the temperature of LEDs and improving the efficiency of light emission. , the corresponding brightness, and prolong the service life. [0003] The existing high heat dissipation copper-based circuit board includes three layers: the first layer is the circuit layer, which is used to design the circuit; the second layer is the insulating and heat-conducting layer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
Inventor 郑嵘施德林
Owner 高德(苏州)电子有限公司
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