BGA (ball grid array) ball-mounting method

Abstract

The invention provides a BGA (ball grid array) ball-mounting method. The method comprises the following steps of selecting solder balls and manufacturing a ball-mounting steel net, i.e. selecting the corresponding solder balls according to the size of bonding pads and the distance between the bonding pads, and manufacturing the ball-mounting steel net; printing a soldering flux, i.e. printing a layer of pasty soldering flux on a BGA substrate; fixing the substrate, i.e. fixing the BGA substrate to a ball-mounting supporting frame; performing alignment operation, i.e. placing the ball-mounting steel net with steel net openings on the ball-mounting supporting frame, enabling the steel net openings to correspond to the BGA bonding pads one to one, and reserving a clearance between the BGA substrate and the steel net; performing ball-reversing operation, i.e. uniformly dispersing solder balls onto the ball-mounting steel net, and swinging the ball-mounting supporting frame so that one solder ball falls onto each bonding pad on the BGA substrate; performing de-molding operation, i.e. separating the ball-mounting steel net from the BGA substrate; performing soldering operation, i.e. performing reflow soldering on the BGA substrate with the solder balls.

Description

technical field [0001] The present invention relates to the field of integrated circuit packaging, more specifically, the present invention relates to a BGA (Ball Grid Array, Ball Grid Array) ball planting method, especially a manual ball planting method. Background technique [0002] With the development of large-scale integrated circuits and ultra-large-scale integrated circuits, people have more and more functional requirements for electronic products, and more and more performance requirements, while the volume requirements are getting smaller and smaller, and the weight requirements are getting lighter and lighter. , which promotes the development of electronic products in the direction of multi-function, high performance, miniaturization and light weight. [0003] To achieve this goal, IC (Integrated Circuit) chips are becoming smaller and smaller in feature size and increasing in complexity. As a result, the number of I / O (input and output) pads in the circuit is inc...

AI Technical Summary

Problems solved by technology

[0005] Therefore, the traditional ball planting method requires special equipment, and the cost of developing packaged chip samples is high; thus, for special equipment ball planting, the adjustment of production process parameters is complicated and takes a long time, which is suitable for mass production, but for small cost It's not suitable to make

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