Loading mechanism compatible with different substrate loading
A loading mechanism and substrate technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of increasing equipment procurement funds, troublesome operation, etc., and achieve the effects of saving equipment procurement costs, simple operation, and ease of use
Inactive Publication Date: 2014-05-07
SHENYANG KINGSEMI CO LTD
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Problems solved by technology
[0002] At present, most semiconductor production plants will choose different production equipment according to different processes when producing and processing substrate wafers of different sizes, which makes the operation troublesome and increases equipment procurement funds.
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[0016] The present invention will be further described below in conjunction with the accompanying drawings.
[0017] Such as figure 2 , 3 As shown, the present invention includes a loading device, a loading tool 5, a cassette and a sensor, wherein the loading device includes a carrier table 6, the loading tool 5 is arranged on the carrier table 6, and wafers of different sizes to be processed are respectively placed on different Among the cassettes, the cassettes containing wafers of different sizes are respectively arranged on the loading platform 6 and the loading tool 5 of the loading device. The sensor is arranged on the loading tool 5, and the sensor is provided with a sensor stopper 504. The sensor is pressed down when the wafer cassette is installed on the loading tool 5 through the sensor stopper 504, and the automatic identification is set on the loading tool 5. 5 on the wafer. Wafers of different sizes to be processed in this embodiment adopt 12-inch wafer 1 and ...
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The invention relates to a substrate loading mechanism and specifically to a loading mechanism compatible with different substrate loading. The mechanism comprises a loading device, a loading fixture, sheet boxes and a sensor. The loading device comprises a supporting table; the loading fixture is arranged on the supporting table; to-be-processed wafers with different dimensions are respectively arranged in different sheet boxes; the sheet boxes equipped with the wafers with different dimensions are respectively arranged on the supporting table of the loading device and the loading fixture; and the sensor is arranged on the loading fixture and automatically identifies the wafers arranged on the loading fixture. The loading mechanism provided by the invention guarantees the correct technical process of substrate wafers with different dimensions on the same equipment, maloperaiton is substantially avoided, and unnecessary trouble is eliminated for operators.
Description
technical field [0001] The invention relates to a loading mechanism for substrates, in particular to a loading mechanism compatible with loading different substrates. Background technique [0002] At present, most semiconductor manufacturers will choose different production equipment according to different processes when producing and processing substrate wafers of different sizes, which makes the operation troublesome and increases equipment procurement funds. Therefore, in order to reduce costs, it is a problem to be solved to put substrate wafers of different sizes on the same equipment for production and processing, and to ensure the correct process of substrate wafers of different sizes. Contents of the invention [0003] In view of the above problems, the object of the present invention is to provide a loading mechanism compatible with loading different substrates. The loading mechanism compatible with loading different substrates ensures the correct process of subs...
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IPC IPC(8): H01L21/67
CPCH01L21/67778H01L21/67294
Inventor 王绍勇
Owner SHENYANG KINGSEMI CO LTD