Connection substrate and package-on-package structure

Abstract

The present invention provides a connecting substrate. The connecting substrate comprises an insulating base material, a plurality of conductive columns and a heat conduction metal frame. The insulating base material possesses a first surface and a second surface which are opposite with each other, and the conductive columns are embedded in the insulating base material and are extended along a direction perpendicular to the second surface. The lengths of the conductive columns protruded out of the second surface are greater than the thickness of the insulating base material, and the heat conduction metal frame is embedded at one side of the second surface of the insulating base material to accommodate an electronic element. The present invention also provides a laminating packaging structure comprising the connecting substrate.

Description

technical field [0001] The invention relates to a semiconductor packaging technology, in particular to a connection substrate and a package-on-package (POP) structure. Background technique [0002] With the continuous reduction of the size of semiconductor devices, the package-on-package structure with semiconductor devices is gradually attracting attention. Package-on-package structures are generally fabricated by a stack-up fabrication method. In the traditional stacking manufacturing method, in order to achieve high-density integration and small-area mounting, the upper and lower packaged devices are usually electrically connected through solder balls with a diameter of 200 microns to 300 microns. However, solder balls with a diameter of 200 microns to 300 microns are not only bulky, but also tend to cause fractures between the solder balls and the electrical contact pads connected to them. The area is also large, so it is difficult to reduce the volume of the package-o...

AI Technical Summary

Problems solved by technology

However, solder balls with a diameter of 200 microns to 300 microns are not only bulky, but also tend to cause fractures between the solder balls and their connected electrical contact pads. The area is also large, which makes it difficult to reduce the volume of the package-on-package structure, and reduces the yield and reliability of the package-on-package structure

The bottom package device is packaged between the upper and lower circuit carriers, the heat generated by it is not easy to dissipate, and the heat dissipation of the bottom package device is poor, which affects the service life of the entire stacked package structure

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