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An active protection device for smart card

A protective device and smart card technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems such as potential safety hazards, achieve the effects of increasing difficulty, resisting frontal laser attacks, and avoiding the lack of single-layer active protection

Active Publication Date: 2016-12-21
BEIJING TONGFANG MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This method has the following disadvantages: firstly, the single-layer metal wire is easy to be cut off by FIB at the point of attack and reconnected at other positions, which cannot be avoided by this patented method; secondly, considering the cost issue, there is At a certain interval, you can only cut off half of the adjacent metals. After doing this, the attacker can reveal the attack position without triggering the alarm, and there is still a great security risk.

Method used

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  • An active protection device for smart card

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Embodiment Construction

[0020] The present invention includes:

[0021] A plurality of active signal sending modules 1, respectively sending active signals;

[0022] A plurality of active signal receiving modules 2 respectively receive active signals sent by corresponding active signal sending modules 1;

[0023] The multi-layer intersecting metal wire layer 3 is located at the top of the chip, shields the area on the smart card chip that needs security protection and transmits the data sent by each active signal sending module 1 to each corresponding active signal receiving module 2; the metal wire layer 3. The transmitted signal is a digital signal or an analog signal; the metal lines of the metal line layer 3 are perpendicular to each other or cross at any angle, and it covers the entire chip or only covers the key signal area;

[0024] A plurality of active signal judging modules 4 are respectively connected with each active signal receiving module 2 and judge whether the obtained data is consis...

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Abstract

An active protection device for a smart card relates to the field of an integrated circuit. The active protection device for the smart card comprises active signal sending modules, active signal receiving modules, metal wire layers and active signal judgment modules. The structure of the active protection device is characterized in that the number of the active signal sending modules, the number of the active signal receiving modules and the number of the active signal judgment modules as well as the number of the metal wire layers are two or more than two. The number of the active signal sending modules, the number of the active signal receiving modules and the number of the active signal judgment modules are identical with the number of the metal wire layers, and an independent multilayered structure is formed. Compared with the prior art, the active protection device for the smart card is capable of preventing invasive attack or semi-invasive attack on the smart card, and has the advantages of being simple in structure and high in reliability.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to an active protection device which has higher requirements on the safety of smart card chips. Background technique [0002] Smart cards combine the development of semiconductor technology and the advantages of card forms, and have been successfully applied in various fields such as telephone cards, traffic cards, and access control systems. Since CPU, memory and various encryption algorithm engines can be integrated on a single chip, smart cards have been successfully applied to the field of bank cards due to their high security. For the field of high security, the measures of smart card against various attacks have become a research hotspot. [0003] Smart card attack methods can be divided into three types: intrusive, semi-invasive and non-invasive. The intrusive attack not only destroys the packaging form of the chip, but also at least destroys the passivation layer of the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/58
Inventor 岳超黄金煌陈冈霍俊杰朱万才邰晓鹏黄钧宋翌丁义民
Owner BEIJING TONGFANG MICROELECTRONICS