Detection method of welding defect rate and bonding rate of target components

Abstract

The invention provides a method for detecting the welding defect rate and the binding rate of a target assembly. The method for detecting the welding defect rate comprises the following steps: providing a standard sample with a known defect area; detecting the defect of the standard sample by an ultrasonic flaw detector to determine detection conditions; providing a target assembly; detecting the target assembly under the detection conditions to obtain the defect area of the target assembly; obtaining the welding defect rate of the target assembly through the defect area of the target assembly, wherein the provision of the standard sample comprises provision of a target and provision of a backboard; welding the target to the backboard; punching the welded backboard, wherein the bottom area of the obtained pore is the defect area of the standard sample. The invention also provides the method for detecting the welding binding rate of the target assembly. The standard sample made by adopting the method enables the subsequent detection accuracy of the target assembly to be high, and is simple and convenient to make.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a detection method for the welding defect rate and bonding rate of target components. Background technique [0002] Vacuum sputtering is a process in which electrons accelerate to the substrate under the action of an electric field and collide with argon atoms, ionizing a large number of argon ions and electrons, and the electrons fly to the substrate, and the argon ions accelerate bombardment sputtering under the action of an electric field Sputtering a large number of target atoms, the neutral target atoms (or molecules) are deposited on the substrate to form a film, and finally achieve the purpose of coating the substrate surface. [0003] More information about vacuum sputtering can also be found in the Chinese patent literature with publication number CN1109512A (publication date: October 4, 1995). [0004] Generally, the manufacture of the target assembly include...

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Problems solved by technology

[0006] The problem to be solved by the present invention is that the existing detection method of the welding defect rate and bonding rate of the target assembly has limitations, especially the detection accuracy of the welding defect rate and bonding rate is not high, and cannot well reflect the welding condition of the entire target assembly

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