Lower electrode base platform of dry etching device and dry etching device

Abstract

The invention discloses a lower electrode base platform of a dry etching device and the dry etching device, and provides a novel lower electrode base platform used by a user to place a substrate base plate on. After the substrate base plate placed on the lower electrode base platform is etched through the dry etching device, uniform damage to the inner structure of the substrate base plate can be avoided, and the undesirable phenomenon of Embossing Mura of a display device is avoided. The lower electrode base platform of the dry etching device comprises a first base plate and a plurality of support pieces located on the first base plate, wherein top material of each support piece at least comprises resin.

Description

technical field [0001] The invention relates to the technical field of etching, in particular to a lower electrode base of dry etching equipment and dry etching equipment. Background technique [0002] In the field of display technology, the glass substrate is usually etched through a dry etching process to produce corresponding patterns. Specifically, the glass substrate to be etched is placed in dry etching equipment, and plasma discharge is used to remove the material to be etched on the glass substrate for etching. [0003] The principle of etching will be described below in combination with the structure of dry etching equipment. [0004] see figure 1 , is a schematic structural diagram of dry etching equipment in the prior art, including: a reaction chamber 100, an upper electrode 101 and a lower electrode 102 located in the reaction chamber 100, and a base 103 for placing a glass substrate 104 on the lower electrode 102; During specific implementation, the glass su...

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Problems solved by technology

[0005] At present, a preferred base 103 above the lower electrode 102 is composed of a substrate and a surface floating point (Embossing Dot) on the surface of the substrate. The surface floating point is made of alumina ceramics. Due to the high hardness of alumina ceramics, generally Its hardness is higher than that of glass. When the glass substrate to be etched is placed on the surface floating point with higher hardness, the surface floating point will inevitably cause a certain degree of damage to the surface and/or internal structure of the glass substrate, resulting in Decreased thickness uniformity of the glass substrate at the point

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