Microchannel cooling device

A cooling device and micro-channel technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve problems such as steam blockage, change of micro-channel, failure of micro-channel heat dissipation system, etc., to achieve the effect of increasing flow rate and improving value

Active Publication Date: 2014-05-28
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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  • Abstract
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Problems solved by technology

[0005] In the process of realizing the present invention, the applicant found that the prior art has the following technical defects: when the microchannel reaches the critical heat flux, steam will block the microchannel, and the microchannel will dry up, resulting in the failure of the microchannel heat dissipation system
At present, metals with high thermal conductivity such as copper or aluminum are used as the base material to pro

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Embodiment Construction

[0027] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be noted that, in the drawings or descriptions of the specification, similar or identical parts all use the same figure numbers. Implementations not shown or described in the accompanying drawings are forms known to those of ordinary skill in the art. Additionally, while illustrations of parameters including particular values ​​may be provided herein, it should be understood that the parameters need not be exactly equal to the corresponding values, but rather may approximate the corresponding values ​​within acceptable error margins or design constraints. The directional terms mentioned in the embodiments, such as "upper", "lower", "front", "rear", "left", "right", etc., are only referring to the directions of the...

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Abstract

The invention provides a microchannel cooling device. The microchannel cooling device comprises a cooling device body and a plurality of microchannels; the cooling device body is made of a shape memory alloy material; a heat-emitting device is attached on the outer surface of the cooling device body; the plurality of microchannels are formed inside the cooling device body; one end of each of the plurality of microchannels is connected with the inlet of a cooling working medium, the other end of each of the plurality of microchannels is connected with the outlet of the cooling working medium; and the shape memory alloy material of the cooling device body is trained, such that the hydraulic diameter of the microchannels above a preset temperature is greater than the hydraulic diameter of the microchannels below the preset temperature. According to the microchannel cooling device of the invention, under high heat flux density, the hydraulic diameter of the microchannels in the trained nickel titanium shape memory alloy is expanded by 1% to 20%, such that, the mass flow rate of the working medium in the microchannels can be increased, and therefore, the numerical value of critical heat flux density can be increased.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic devices, in particular to a microchannel cooling device. Background technique [0002] With the increase of the performance and integration of electronic devices, the power consumption of electronic devices is constantly rising, and the size is gradually decreasing, so the heat flux density is rising sharply, even reaching 100W / cm 2 Above the order of magnitude, this has become a bottleneck restricting the development of electronic devices to high performance. Under such heat flux conditions, the traditional air-cooled and water-cooled methods have limited heat flux density (generally, air-cooled heat flux density is 1W / cm 2 Below, the heat extraction and heat flow density of water cooling can reach 50-100W / cm 2 ), it has been difficult to efficiently extract heat from the surface of electronic devices and efficiently release it to the environment. Therefore, it has become...

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Application Information

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IPC IPC(8): H05K7/20
Inventor 姜玉雁王涛唐大伟
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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