Copper plate grounding grid antistatic terrazzo floor construction process

Abstract

The invention discloses a copper plate grounding grid antistatic terrazzo floor construction process which includes the steps of firstly, constructing a cement ground base layer; secondly, painting an insulating isolation layer; thirdly, laying ESD copper plate grounding grids; fourthly, retaining an ESD grounding connecting box; fifthly, embedding glass grid separating strips; sixthly, laying an antistatic terrazzo surface layer. By the method, construction cost is lowered without affecting the load-bearing performance and pressure resistance of the ground, the constructed copper plate grounding grid antistatic terrazzo floor is fast, stable and reliable in static discharge grounding performance and long in service life.

Description

technical field [0001] The invention relates to a construction technique for antistatic terrazzo ground of copper plate grounding grid. Background technique [0002] Before there is a breakthrough in the new technology, the modification of cement materials must be solved by adding conductive materials. The traditional anti-static terrazzo floor method requires adding conductive materials to the cement base (leveling layer) to make it have static conductive properties, which is not only expensive (the material cost of conductive materials in a 3-4cm leveling layer is 55 yuan / m 2 ), and the strength of the cement base is reduced due to the addition of conductive materials, and because the flat steel or reinforced grounding grid is laid under the cement base, the thicker the cement surface layer, the conductive material constructed by adding conductive materials The more difficult the link of the static discharge path is, the longer the static electricity generated on the grou...

AI Technical Summary

Problems solved by technology

The traditional anti-static terrazzo floor method requires adding conductive materials to the cement base (leveling layer) to make it have static conductive properties, which is not only expensive (the material cost of conductive materials in a 3-4cm leveling layer is 55 yuan / m 2 ), and the strength of the cement base is reduced due to the addition of conductive materials, and because the flat steel or reinforced grounding grid is laid under the cement base, the thicker the cement surface layer, the conductive material constructed by adding conductive materials The more difficult the link of the static discharge path, the longer the static electricity generated on the ground surface is transmitted to the ground grid through the conductive grid

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