Failure predicting method and device aiming at electronic single chip under hot standby environment
A fault prediction and thermal standby technology, applied in prediction, data processing applications, calculations, etc., can solve problems affecting production economic benefits, system working condition recovery, etc., and achieve high reliability, real-time fault prediction, and stable performance
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[0027] The embodiments of the present invention will be described in detail below in conjunction with the structure and flow chart of the accompanying drawings. It should be emphasized that the following description is only exemplary and not intended to limit the scope of the invention and its application.
[0028] The method provided by the invention comprises:
[0029] Step 1: According to the characteristics of electronic products, analyze and extract their failure modes, deeply understand the structure and function of typical stand-alone machines, and clarify their main components, functions, and working modes. Equipment failure; for example, for general-purpose diodes, the main failure omen parameters are known through analysis and extraction: reverse current leakage, forward voltage drop, thermal resistance, power consumption and radio frequency noise, so for general-purpose diodes, these parameters can be detected Fault harbinger parameters to predict its potential fau...
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