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Failure predicting method and device aiming at electronic single chip under hot standby environment

A fault prediction and thermal standby technology, applied in prediction, data processing applications, calculations, etc., can solve problems affecting production economic benefits, system working condition recovery, etc., and achieve high reliability, real-time fault prediction, and stable performance

Inactive Publication Date: 2014-06-11
BEIHANG UNIV
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  • Claims
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AI Technical Summary

Problems solved by technology

However, in the actual production process, the operating conditions of many productions are relatively harsh, and the consequences of failures are relatively serious. It is not enough to only know whether the current working conditions are normal, because the working conditions may already be in danger when a failure is discovered. Operating area, at this time, it is difficult for the operator to restore the system working condition to the normal region, or although the working condition can be restored to the normal region, the economic benefits of production have been seriously affected

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  • Failure predicting method and device aiming at electronic single chip under hot standby environment
  • Failure predicting method and device aiming at electronic single chip under hot standby environment
  • Failure predicting method and device aiming at electronic single chip under hot standby environment

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Embodiment Construction

[0027] The embodiments of the present invention will be described in detail below in conjunction with the structure and flow chart of the accompanying drawings. It should be emphasized that the following description is only exemplary and not intended to limit the scope of the invention and its application.

[0028] The method provided by the invention comprises:

[0029] Step 1: According to the characteristics of electronic products, analyze and extract their failure modes, deeply understand the structure and function of typical stand-alone machines, and clarify their main components, functions, and working modes. Equipment failure; for example, for general-purpose diodes, the main failure omen parameters are known through analysis and extraction: reverse current leakage, forward voltage drop, thermal resistance, power consumption and radio frequency noise, so for general-purpose diodes, these parameters can be detected Fault harbinger parameters to predict its potential fau...

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Abstract

The invention discloses a failure predicting method and a failure predicting device aiming at an electronic single chip under a hot standby environment. The method comprises the following steps: predicting the failure of an electronic device by using a combinational algorithm of an expert system and a gray prediction model, designing a corresponding knowledge table and realizing a reasoning process by using a quick matching method of rules. The device comprises a controller module, a power supply module, a touch display screen, an LED (Light Emitting Diode) alarm module, a test bench chassis, a data collecting and caching module, a gray prediction module and an expert system module. Through the method and the device, latent failures of the electronic single chip can be efficiently and accurately predicted in real time, so that the guarantee for reliable operation of the electronic single chip of the device can be provided.

Description

technical field [0001] The invention belongs to the technical field of electronic stand-alone fault prediction, and in particular relates to a fault prediction method and prediction equipment for electronic stand-alone hot standby environment. Background technique [0002] With the rapid development of modern electronic systems and science and technology, modern electronic systems are becoming larger and more complex, with more functions and more complex structures, and the losses caused by electronic system failures will also increase greatly. In-depth research on the failure mechanism of the electronic system, based on the actual state monitoring, trend analysis and prediction of possible failures of the system, the "condition-based maintenance" and "predictive maintenance" that eliminate failures in the bud will become electronic systems. The development direction of the future assurance and maintenance of the system. Predictive maintenance is to formulate maintenance pl...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06Q10/04
Inventor 张庆振黄亚程林王金朔李腾陶飞
Owner BEIHANG UNIV
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