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Wafer cutting machine

A circular cutting machine and wafer technology, applied in shearing devices, shearing machine equipment, metal processing equipment, etc., can solve the problems of small processing range, low work efficiency, small processing thickness, etc., to achieve stable and reliable operation and improve work efficiency. The effect of efficiency

Active Publication Date: 2014-06-18
YIXING HOKKAI HEAD PLATE
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, most of the cutting devices used in the head industry have low work efficiency. Since the slices need to be processed in the initial production process of the head, the requirements for the cutting device are relatively high, and the cutting device currently used is in the processing circle. The processing accuracy has not been very ideal, and the outer circle of the processed wafer is not smooth, there are burrs and gaps, and further processing is required, which is time-consuming and labor-intensive.
There are also some other problems with the currently used cutting device, such as a small processing range and a small processing thickness

Method used

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  • Wafer cutting machine

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Embodiment Construction

[0013] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0014] like figure 1 As shown, a kind of wafer cutting machine according to the present invention includes a workbench 1, a circle cutting machine body 2 is arranged on the top of the workbench 1, and the circle cutting machine body 2 includes a cutting device 3 and a positioning The clamping device 4, the cutting device 3 and the positioning clamping device 4 are relatively arranged on the workbench 1, the cutting device 3 includes a hob 6 and a scrap cutter 7 connected to the motor drive device 5, the The scrap cutter 7 is arranged below the hob 6, and the positioning clamping device 4 includes an XY axis positioning device 8 and an oil cylinder clamping device 9, and the oil cylinder clamping device 9 is arranged above the XY axis positioning device 8, and The inside of the workbench 1 is provided with a workbench moving motor 10; the hob 6 is provi...

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Abstract

The invention relates to a wafer cutting machine. The wafer cutting machine comprises a workbench; the upper portion of the workbench is provided with a wafer cutting machine body which comprises a cutting device and a positioning clamping device; the cutting device and the positioning clamping device are oppositely arranged on the workbench; the cutting device comprises a hob cutter and a waste cutter which are connected with a motor driving device; the waste cutter is arranged under the hob cutter; the positioning clamping device comprises an X and Y axis positioning device and an oil cylinder clamping device; the oil cylinder clamping device is arranged above the X and Y axis positioning device; a workbench mobile motor is arranged inside the workbench. According to the wafer cutting machine, the cutting accuracy is high, the machining range is large, and the working efficiency can be improved.

Description

technical field [0001] The invention relates to a cutting device, in particular to a circle cutting machine. Background technique [0002] At present, there are various cutting devices on the market, which are used in various occasions. Among them, most of the cutting devices used in the head industry have low work efficiency. Since the slices need to be processed in the initial production process of the head, the requirements for the cutting device are relatively high, and the cutting device currently used is in the processing circle. The processing accuracy has not been very ideal, and the outer circle of the processed wafer is uneven, with burrs and gaps, which requires further processing, which is time-consuming and labor-intensive. There are also some other problems with the currently used cutting devices, such as a small processing range and a small processing thickness. Therefore, it is an urgent problem to be solved to manufacture a cutting device with high process...

Claims

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Application Information

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IPC IPC(8): B23D31/00
Inventor 王华陈建东张斌峰高艳华张立群
Owner YIXING HOKKAI HEAD PLATE
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