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Shielding case and manufacturing method thereof

A technology of shielding cover and insulating cover, applied in the fields of magnetic field/electric field shielding, electrical components, etc., can solve the problems of high mold cost, mold maintenance cost, high mold allocation cost, and high assembly cost, and achieve low assembly cost and low processing cost. , the effect of low cost

Inactive Publication Date: 2014-06-25
领胜科技(苏州)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The cost of the mold and the cost of mold maintenance are also high, especially for products that require a small number of products, the cost of the mold alone is very high
However, during the use of the existing shielding cover, the legs of the shielding cover product are generally welded to the parts that need to be protected, such as the PCB board, with a metal welding process. The process is complicated and the assembly cost is high.

Method used

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  • Shielding case and manufacturing method thereof
  • Shielding case and manufacturing method thereof
  • Shielding case and manufacturing method thereof

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Embodiment Construction

[0025] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0026] refer to figure 1 The present invention provides a shielding cover, which includes an insulating cover body 1 and a metal conductive layer 2 arranged on the outer side of the insulating cover body 1, and the thickness of the metal conductive layer 2 is 0.001-0.003 mm. The insulating cover body 1 is made of PS or PC. The thickness of the insulating cover 1 is 0.3-1.6 millimeters. The metal conductive layer 2 includes a first metal layer 201, a second metal layer 202 and a third metal layer 203, the first metal layer 201 is a nickel layer, the second metal layer 202 is a copper layer, and the third metal layer 203 is a silver layer or 18K gold layer, the first metal layer 201 covers the outer side of the insulating cover 1 , the second metal layer 202 covers the first metal layer 201 , and the third metal layer 203 covers the second metal layer 202 . ...

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Abstract

The invention discloses a shielding case and a manufacturing method of the shielding case. The shielding case comprises an insulating case body and a metal conducting layer arranged on the outer side of the insulating case body. The thickness of the metal conducting layer is 0.001mm-0.003mm. The shielding case and the manufacturing method of the shielding case have the advantages that the shielding case is formed by arranging the metal conducting layer on the insulating case body, the structure is light and simple, working procedures are simple, processing efficiency is high, and assembly cost is low.

Description

technical field [0001] The invention relates to electromagnetic shielding technology, in particular to a shielding cover and a preparation method thereof. Background technique [0002] In the field of electronic manufacturing, shielding covers have a wide range of applications, mainly in mobile phones, GPS (positioning system) and other fields. Use the shielding cover to surround the components on the PCB board (printed circuit board) and electronic components such as LCM (liquid crystal module), circuits, assemblies, wires or interference sources of the entire system to prevent the interference electromagnetic field from spreading outward and prevent them from being affected. The influence of the external electromagnetic field, so as to achieve the purpose of anti-electromagnetic interference. The material of the existing shielding cover is generally processed by metal materials such as stainless steel, nickel-nickel copper, and nickel-plated steel plates of different thic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
Inventor 曾芳勤
Owner 领胜科技(苏州)有限公司
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