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Epoxy resin composition for encapsulating a semiconductor device and semiconductor device encapsulated using the same

A technology of epoxy resin and composition, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electric solid-state devices, etc., and can solve poor adhesion of chips and adhesive films, poor moisture resistance of organic adhesive films, and package cracking And other issues

Inactive Publication Date: 2014-07-02
CHEIL IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, delamination between the chip and the die-adhesive film is likely to occur due to the poor adhesion of the die-adhesive film, and package cracking is likely to occur due to the poor moisture resistance of the die-adhesive film

Method used

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  • Epoxy resin composition for encapsulating a semiconductor device and semiconductor device encapsulated using the same
  • Epoxy resin composition for encapsulating a semiconductor device and semiconductor device encapsulated using the same
  • Epoxy resin composition for encapsulating a semiconductor device and semiconductor device encapsulated using the same

Examples

Experimental program
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Effect test

Embodiment 1 to 4 and comparative example 1 to 3

[0120] Each component was weighed in an amount as listed in Table 1, and uniformly mixed using a Henschel mixer to prepare a primary composition in a powder state. Subsequently, the composition was melt-kneaded at 95° C. using a continuous kneader, then cooled and ground to prepare an epoxy resin composition for encapsulating a semiconductor device.

[0121] Table 1

[0122]

[0123] The physical properties and reliability of the prepared epoxy resin compositions were evaluated as follows. Table 2 shows the results of physical property evaluation of the epoxy resin composition.

[0124]

[0125] (1) Flowability (inches): According to EMMI-1-66, using evaluation molds and conversion molding presses at 175°C and 70kgf / cm 2 down the measurement process. Higher numbers indicate better flowability.

[0126] (2) Glass transition temperature (°C): The glass transition temperature was measured using a thermomechanical analyzer (TMA) under the condition of increasing the tempe...

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Abstract

The present invention provides an epoxy resin composition for encapsulating a semiconductor device, comprising: an epoxy resin, a curing agent, a curing accelerator, a coupling agent, and an inorganic filler, wherein the coupling agent comprises an alkylsilane compound represented by Formula 1: wherein R1, R2 and R3 are each independently a C1 to C4 alkyl group, R is a C6 to C31 alkyl group, and n ranges from about 1 to 5 on average.

Description

technical field [0001] The present invention relates to an epoxy resin composition for packaging a semiconductor device and a semiconductor device packaged using the same. More specifically, the present invention relates to an epoxy resin composition for encapsulating a semiconductor device, which contains a coupling agent of a special structure to provide excellent moldability (moldability, moldability) and high reliability, and encapsulation using the same semiconductor devices. Background technique [0002] Recently, miniaturization, size diversification, and multilayer interconnection of interconnections have rapidly progressed as the integration density of semiconductor devices has increased. In view of high-density stacking on a printed substrate, that is, surface mount technology, packages for protecting semiconductor devices from external environments have been made compact and thin. [0003] In resin-encapsulated semiconductor devices in which semiconductor device...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/04C08K5/5435C08K5/548C08K5/54C08K7/18C08K3/04C08K3/22H01L23/29
CPCH01L2924/0002C08G77/04H01L23/295C08K5/5419H01L2924/00C08L63/00C08K5/5415C08K3/00H01L23/29
Inventor 裴庆徹
Owner CHEIL IND INC