Method for solving problems of glue overflowing, glue attachment and glue drawing on needle in SMD (Surface Mount Device) type LED (Light Emitting Diode) sealing procedure by use of film releasing agent

A film release agent and needle technology, which is applied in the fields of glue pulling, glue hanging, and needle climbing glue, can solve the problems of wasting resources, reducing production efficiency, increasing production costs, etc., to improve production efficiency, reduce quality costs, and reduce costs. Effect

Inactive Publication Date: 2014-07-16
SHENZHEN JINGTAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, most companies encounter the needle creeping phenomenon in the sealing process. The direct way is to replace the needle or replace the sealing ring, etc., or repeate

Method used

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  • Method for solving problems of glue overflowing, glue attachment and glue drawing on needle in SMD (Surface Mount Device) type LED (Light Emitting Diode) sealing procedure by use of film releasing agent
  • Method for solving problems of glue overflowing, glue attachment and glue drawing on needle in SMD (Surface Mount Device) type LED (Light Emitting Diode) sealing procedure by use of film releasing agent

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] Such as figure 1 with figure 2 As shown: the embodiment of the present invention discloses a method for solving the problems of needle climbing, hanging and pulling glue in the SMD-type LED sealing process by using the release agent 4, which is characterized in that it includes the following steps:

[0020] a. After debugging the machine, wipe the surface of the dispensing needle 1 with a dust-free cloth to ensure that the surface is smooth, clean, an...

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Abstract

The invention discloses a method for solving problems of glue overflowing, glue attachment and glue drawing of a needle in SMD (Surface Mount Device) type LED (Light Emitting Diode) sealing procedure by use of a film releasing agent. The method comprises the following steps: a. after debugging a machine, wiping the surface of a glue dispensing needle with non-dust cloth to ensure that the surface is smooth, clean and dry and has no glue or other pollutants; b. dipping a piece of clean dust-free cloth in the film releasing agent, wiping a glue injection outlet of the glue dispensing needle with the non-dust cloth, wherein the film releasing agent needs to be prevented from dropping on the material under the needle during the process of dipping the dust-free cloth in the film releasing agent; c. checking the glue dispensing needle, wherein only a thin layer of film releasing agent is left on the surface of the glue dispensing needle, and the needle cannot be wiped with too much film releasing agent; d. evaporating the film releasing agent for 5-10min after wiping; and e. starting the machine for operation. According to the method, after the glue dispensing needle is wiped with the film releasing agent, the surface of the needle of the machine has certain repulsive action on epoxy resin adhesive for sealing and the problems of glue overflowing, glue attachment and glue drawing on the needle are solved well.

Description

technical field [0001] The invention relates to the field of LED packaging, and more specifically relates to a method for solving the problems of needle climbing, hanging and pulling glue in the SMD LED sealing process by using a film release agent. Background technique [0002] For the sealing process of the entire LED industry, due to the existence of the inherent polar hydroxyl and ether bonds in the epoxy resin molecule, it has high adhesion to various substances, so in the process of LED sealing process It is very easy to have the phenomenon of needle creeping. In the LED packaging process, needle creep is a very serious problem. When there is too much needle creep, it will form needle pull, which will cause serious unevenness in the amount of glue produced by the LED material, which seriously affects the product quality and quality of each company. Cost of production. [0003] The serious problem of needle creeping and hanging glue is increasingly valued by various c...

Claims

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Application Information

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IPC IPC(8): B05C5/00B05C11/10H01L33/00
Inventor 龚文
Owner SHENZHEN JINGTAI
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