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Cooling device

A heat dissipation device and heat dissipation pipe technology, which is applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of affecting the service life of the heat dissipation device, poor heat dissipation effect of the heat dissipation device, etc., and achieve good heat dissipation effect Effect

Inactive Publication Date: 2014-07-16
杨顺
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Problems solved by technology

The heat dissipation effect of this heat dissipation device is poor, thereby affecting the service life of the heat dissipation device

Method used

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  • Cooling device
  • Cooling device
  • Cooling device

Examples

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Embodiment Construction

[0019] The present invention is described in further detail in conjunction with accompanying drawing, as figure 1 , figure 2 , image 3 As shown, three heat-absorbing pipes 4 are inlaid on the bottom plate 5, and a plurality of cooling fins 1 are connected to the three heat-dissipating pipes 2; Filled with a fluid heat-absorbing medium. The fluid heat conduction medium is R134A, R410A and the like.

[0020] The bottom plate 5 can be set according to the surface of the device to be dissipated, and the bottom plate 5 can be set in a shape matching the surface of the device to be dissipated, such as a flat plate. The bottom plate can be made of aluminum alloy plate. The radiating pipe and / or the heat absorbing pipe are made of copper pipes.

[0021] The number of heat dissipation pipes and heat absorption pipes can be set according to actual heat dissipation requirements. A plurality of circuits can be formed by connecting the heat-absorbing pipes and the heat-dissipating ...

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Abstract

The invention discloses a cooling device which is good in cooling effect. The cooling device comprises a base plate and cooling fins, wherein heat-absorbing pipes are embedded in the base plate, the cooling fins are connected to a cooling pipe, the two ends of each heat-absorbing pipe are communicated with the two ends of the cooling pipe so that a return circuit can be formed, and the heat-absorbing pipes and the cooling pipe are filled with flowing heat-conducting media. At least three heat-absorbing and cooling units which are formed by communicating the heat-absorbing pipes with the cooling pipe are arranged. According to the cooling device, heat absorbed by the base plate can be taken away in time by the flowing heat-conducting media in the heat-absorbing pipes, the heat is transmitted to the cooling fins through the cooling pipe, and then the heat is dissipated into the atmosphere through the cooling fins. Compared with an existing cooling device, the cooling device has the advantage of being good in cooling effect.

Description

technical field [0001] The invention relates to a heat dissipation device. Background technique [0002] In the existing heat dissipation device, the top is a heat sink, and the bottom is a flat plate or a bottom plate matched with the surface of the heat dissipation device, and the heat sink is arranged on the bottom plate. When in use, the heat dissipated device transfers the heat generated during its operation to the base plate in contact with the dissipated device, and the base plate then transfers the heat to the heat sink on the base plate, and the heat sink then dissipates the heat into the air. The heat dissipation effect of the heat dissipation device is poor, thereby affecting the service life of the heat dissipation device. Contents of the invention [0003] The technical problem solved by the invention is to provide a heat dissipation device with good heat dissipation effect. [0004] The technical solution of the present invention is completed in this way. A...

Claims

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Application Information

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IPC IPC(8): H01L23/367H05K7/20
Inventor 杨顺张学志
Owner 杨顺
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