Thin film coating equipment for semiconductor manufacturing
A thin-film coating, semiconductor technology, applied in the manufacture of semiconductor/solid-state devices, devices for coating liquid on the surface, coatings, etc., can solve problems such as photomask damage, and achieve the effect of uniform thickness
Active Publication Date: 2016-08-03
考姆爱斯株式会社
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Problems solved by technology
[0004] When a high-precision, high-density printed circuit board is manufactured by using the commonly used bonding method of bonding a photomask to a printed circuit board and exposing it, due to the bonding of the photomask and the circuit board, every time exposure Damage to the photomask occurs, and there is a problem that it is impossible to precisely form patterns such as circuits and solder resists on the circuit board
Method used
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Embodiment Construction
[0033] The invention relates to a thin film coating device for semiconductor manufacturing, which is characterized in that it comprises: a main roller (10), which is in surface contact with the other side of the film;
[0034] a coating roller (20), which is rotated by means of a rotating device, is provided adjacent to and parallel to said main roller (10), and is in surface contact with one side of the film;
[0035] A coating solution supply roller (30) is provided on the opposite side of the main roller (10), adjacent to and spaced apart from the coating roller (20) in parallel, and is immersed in the coating solution storage in the lower part. In the state of the container (39), after the surface is stained with the coating solution, it is coated on the surface of the coating roller (20);
[0036] a film guide (40), which guides the film to the gap between said main roller (10) and roller (20);
[0037] a hardening device unit (50) that heats and hardens the film coated ...
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The present invention relates to a film coating apparatus. The film coating apparatus includes: a main roller (10) contacting the other surface of a film; a coating roller (20) parallel and adjacent to the main roller (10) to contact one surface of the film; a coating solution supply roller (30) parallel and adjacent and spaced from the coating roller (20) on a side opposite to that of the main roller (10), the coating solution supply roller (30) applying a coating solution on a surface of the coating roller (20) after the coating solution is smeared on a surface of the coating solution supply roller (30) in a state where a lower portion of the coating solution supply roller (30) is immersed into a coating solution reservoir (39); a film guide part (40) guiding the film into a gap between the main roller (10) and the coating roller (20); a curing unit (50) curing the film on which the coating solution is applied while passing through the gap between the main roller (10) and the coating roller (20) at a high temperature; and a conveyor (60) transferring the film to pass through the curing unit (40).
Description
technical field [0001] The present invention relates to a mask for ultraviolet exposure or a coating device for an artwork film for ultraviolet exposure of a board (Board). [0002] It is mainly used for UV coating of masks or original image films used in the UV exposure step of a flexible substrate (Board) coated with a UV photosensitive film. Background technique [0003] Recently, with the lightweight, ultra-thin, short and high-functionality of electronic products, printed circuit boards have become more precise and dense. Therefore, on the surface of the substrate coated with photoresist and other photosensitive materials, with the help of The photolithography method, which forms a pattern on a substrate by means of an etching process after the exposure device is exposed to light and forms an image of a predetermined pattern, is being applied to the manufacture of printed circuit boards. [0004] When a high-precision, high-density printed circuit board is manufactured...
Claims
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IPC IPC(8): H01L21/027G03F7/26
CPCB05C1/083B05C1/0834
Inventor 黄善伍
Owner 考姆爱斯株式会社